06/05/2017  Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs.

06/05/2017  All-carbon, spintronic proposal could lead to smaller, better performing structures in electronics.

06/05/2017  Flagship researchers integrate graphene and quantum dots with CMOS technology to create an array of photodetectors, producing a high resolution image sensor.

06/05/2017  Less than two years since announcing a 7nm test chip, scientists have achieved another breakthrough.

06/01/2017  Top spenders expected to represent 83% of total semiconductor industry spending this year.

06/01/2017  SEMI’s year-to-date worldwide semiconductor equipment billings year-to-date through March show a 59.6 percent gain to the same period last year.

05/31/2017  Imec and Cascade announced the successful development of a fully-automatic system for pre-bond testing of advanced 3D chips.

05/31/2017  22% forecast increase driven by system growth, rising ASPs for memory and logic devices.

05/23/2017  Autonomous automobiles, smart manufacturing, smart buildings, mobile human health monitoring, and 4G+ communications hardware for connecting all these devices will drive strong 24 percent growth in units and 14 percent in value for the MEMS sector.

05/23/2017  North America-based manufacturers of semiconductor equipment posted $2.17 billion in billings worldwide in April 2017 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

05/23/2017  GLOBALFOUNDRIES and the Chengdu municipality today announced an investment to spur innovation in China's semiconductor industry.

05/22/2017  Amkor Technology, Inc. today announced that it has completed the acquisition of NANIUM S.A., a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.

05/22/2017  Materials scientists in Japan have developed a new diamond transistor fabrication process that promises to advance the development of more robust and energy-efficient electronics.

05/22/2017  As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor industry has an unprecedented growth opportunity.

05/15/2017  Worldwide semiconductor revenue totaled $343.5 billion in 2016, a 2.6 percent increase from 2015 revenue of $334.9 billion, according to final results by Gartner, Inc.

05/12/2017  Renesas Electronics Corporation announced it will consolidate its subsidiary Renesas System Design, Co., Ltd. through an absorption-type merger.

05/11/2017  Synopsys, Inc. today announced that its IC Validator was successfully deployed on some of the industry's largest and most advanced designs to accelerate design rule checking (DRC) closure.

05/03/2017  High-performance packages now available for on-line purchase.

05/01/2017  The Firefly System with Clearfind Technology helps manufacturers find defects earlier in the process – improving reliability of devices.

04/27/2017  Phone companies shipped a total of 347.4 million smartphones worldwide in the first quarter of 2017 (1Q17).