04/27/2017  World-first images of electric currents in graphene released.

04/27/2017  With its unique characteristics, FD-SOI is generating increasingly strong interest from major players in the semiconductor ecosystem for a very wide range of markets.

04/25/2017  The new Samsung Galaxy S8 equipped with 64 gigabytes (GB) of NAND flash memory carries a bill of materials (BOM) cost that comes out to US$301.60, much higher than for previous versions of the company’s smartphones, according to a preliminary estimate from IHS Markit.

04/25/2017  Today, SEMI announced that SEMICON Southeast Asia 2017 (SEMICON SEA 2017) is reporting an increase of up to 30 percent in attendees this year.

04/24/2017  Chroma ATE Inc. has recently released the newest semiconductor test solution for the IoT IC market.

04/24/2017  Researchers at Tokyo institute of Technology presented a design guide for reducing 30% of thermal resistance for 3-dimensional (3D) stacked devices compared with the conventional ICs using solder bump joint structure.

04/21/2017  North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March 2017, according to the March Equipment Market Data Subscription Billings Report published today by SEMI.

04/20/2017  The ConFab — an executive conference now in its 13th year — brings together influential executives from all parts of the semiconductor supply chain for three days of thought-provoking talks and panel discussions, networking events and select, pre-arranged breakout business meetings.

04/19/2017  Worldwide PC shipments totaled 62.2 million units in the first quarter of 2017, a 2.4 percent decline from the first quarter of 2016, according to preliminary results by Gartner, Inc.

04/19/2017  Samsung expands 10nm capacity, to be ready for production by the fourth quarter of this year.

04/17/2017  According to the latest market study released by Technavio, the electrostatic discharge (ESD) packaging market is projected to grow to USD 5.42 billion by 2021, at a CAGR of more than 8% over the forecast period.

04/17/2017  At SEMICON Southeast Asia 2017, Dr. Chen Fusen, CEO of Kulicke & Soffa Pte Ltd, Singapore, will give a keynote on digital transformation in the manufacturing sector.

04/14/2017  Axcelis Technologies, Inc. announced today that it has received multiple orders for the Purion H high current, Purion XE high energy, and Purion EXE extended high energy system from several leading chip manufacturers in the Asia Pacific region.

04/14/2017  DDR4 and DDR3 forecast to represent 97% of sizzling 2017 DRAM market.

04/13/2017  Kulicke & Soffa Industries, Inc. announced today the opening of its latest Process and Applications laboratory at the K&S Netherlands facility.

04/13/2017  In 2016, the MOSFET market recovered, after a minor downturn in 2015.

04/12/2017  The factors that are driving the growth of this market include the growth in the consumer electronics market, low wafer and gate cost, low operating voltage, and miniaturization of semiconductor devices.

04/10/2017  NXP Semiconductors N.V. today announced a new laterally diffused metal oxide semiconductor (LDMOS) technology for RF power transistors designed for operation up to 65 volts (V).

04/10/2017  New IT-EMCCD image sensors combine improved low-light and NIR sensitivity with simplified integration for camera manufacturers.

04/10/2017  MagnaChip Semiconductor Corporation announced today that it will host its Annual U.S. Foundry Technology Symposium at Hilton Santa Clara, California, on June 7th, 2017.