03/06/2017  Year-to-year growth is market's largest since November 2010; month-to-month sales decrease slightly.

03/06/2017  Promising alternative for MOSFET in future ultralow power chips.

03/03/2017  Yole analysts provide an overview of advanced substrate technologies, markets, and supply chain.

02/27/2017  Renesas Electronics Corporation and Intersil Corporation announced the completion of Renesas' acquisition of Intersil Corporation.

02/27/2017  Rice University researchers simulate two-dimensional hybrids for optoelectronics.

02/27/2017  Dream Chip Technologies announced today the presentation of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications at the Mobile World Congress in Barcelona.

02/21/2017  Scientists combine the ultra-fast with the ultra-small to pioneer microscopy at terahertz frequencies.

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

02/21/2017  Optimized RF features deliver high-performance solutions for mmWave beam forming applications in 5G smartphones and base stations.

02/20/2017  At the recent IEEE 3DIC Conference, Koyanagi and co-workers at Tohoku Univ reported on their studies of Ti as a 3D TSV barrier layer.

02/19/2017  At SEMI's Industry Strategy Syposium this year, a merger's and acquisitions panel, moderated by Robert Maire of Semiconductor Advisors, took a look at how the industry might look in the future.

02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

02/17/2017  With this partnership, SEMCO will license GE microelectronics packaging patent portfolio, covering the fabrication of substrates embedded with electronic circuits.

02/17/2017  The explosive growth in demand for internet bandwidth and cloud computing capacity brings a new set of technology challenges and opportunities for the semiconductor supply chain.

02/14/2017  The market is expected to be worth USD 170.46 billion in 2022, at a CAGR of 38.30% between 2016 and 2022.

02/13/2017  ON Semiconductor today announced its top distribution partners for 2016.

02/13/2017  The company will continue investing in its wafer plants in the United States and Germany, expand its capacity in Singapore, and construct a facility to produce 12-inch wafers in Chengdu, China in order to satisfy Chinese and global demands for the company's 22FDX technology.

02/10/2017  The company is investing in its existing leading-edge fabs in the United States and Germany, expanding its footprint in China with a fab in Chengdu, and adding capacity for mainstream technologies in Singapore.

02/09/2017  Grant A. Pierce, chief executive officer (CEO) of Sonics, Inc. was elected by the Board of Directors of the Electronic System Design Alliance (ESD Alliance) to serve as its chairman.

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.