02/09/2017  Significant and noticeable IC market growth closely tied to significant worldwide GDP growth.

02/07/2017  Former Standard Products Division of NXP combines experience, product and operational excellence with customer focus and ambition.

02/06/2017  Toshiba America Electronic Components, Inc. (TAEC) has added a new photorelay to its extensive lineup of photocouplers.

02/03/2017  Worldwide industry posts highest-ever annual sales; year-to-year sales increase 12 percent in December.

02/03/2017  The Boards of Directors of both Veeco and Ultratech have unanimously approved the transaction.

02/03/2017  Qualcomm Incorporated and TDK Corporation today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd.

02/02/2017  Amkor Technology, Inc. and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.

02/02/2017  Micron Technology, Inc. today announced the upcoming retirement of its Chief Executive Officer, Mark Durcan.

02/02/2017  Researchers investigate mechanics of lithium sulfides, which show promise as solid electrolytes.

02/01/2017  Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2016, representing 18.2 percent of the total worldwide market, according to Gartner, Inc.

02/01/2017  “Do not go where the path may lead, go instead where there is no path and leave a trail,” was how I started last week’s article. In that article we looked back on 2016 and the incredible progress of the industry and how it continually cuts new trail and keeps moving at the speed of Moore’s Law.

02/01/2017  IC Insights believes China's self-sufficiency targets for ICs of 40% in 2020 and 70% in 2025 are unrealistic.

01/31/2017  FlexTech, a SEMI strategic association partner, today announced a contract with ITN Energy Systems of Littleton, CO to develop and produce a flexible, solid-state lithium battery reducing packaging bulk by integrating a thin, flexible ceramic substrate.

01/30/2017  Slight shift in sourcing from U.S. to Mexico, India, and Asia; most companies taking cautious approach to sourcing outside home region in 2017.

01/30/2017  Globally, development of efficient and advanced technology, rising demand for electronic devices including laptops, tablets, gaming consoles, smartphones, flourishing electronics and semiconductor industry, and advantageous properties of semiconductor Epi' (Epitaxy) wafer are the prime growth drivers of the semiconductor Epi' (Epitaxy) wafer manufacturing market.

01/30/2017  Axcelis Technologies, Inc. announced today that it has received orders for the Purion H high current implanter from two leading manufacturers of memory devices in the Asia Pacific region.

01/27/2017  Technavio’s latest market research report on the global field-programmable gate array (FPGA) market provides an analysis of the most important trends expected to impact the market outlook from 2017-2021.

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

01/26/2017  The global semiconductor chip packaging market is expected to grow at a CAGR of more than 31% during the forecast period.

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.