01/24/2017  Electronics manufacturing solutions for Automotive, Smart Manufacturing and Healthcare enabling the future of European technology.

01/24/2017  At next week’s SPIE Photonics West in San Francisco, imec, a research and innovation hub in nano-electronics and digital technologies, will introduce a new image sensor with integrated color (Red Green Blue, RGB) and narrow-band near-infrared (NIR) filters.

01/24/2017  Amtech Systems, Inc. today announced fiscal year 2017 year-to-date order bookings through January 20, 2017 are approximately $84 million.

01/23/2017  STATS ChipPAC Pte. Ltd. announced today that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2016 Patent Power Scorecards published by the Institute of Electrical and Electronics Engineers.

01/20/2017  Breakthrough results pave the way to multi-layer 3D ICs with high density interconnects realized by automated wafer-to-wafer bonding technology.

01/19/2017  Richard Beyer and John Hodgson will retire from the Company's Board of Directors, effective as of the Company's 2017 Annual Meeting of Shareholders.

01/19/2017  TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fan- out WLP (FO-WLP).

01/19/2017  The expert panel, "The Future of M&A in the Semiconductor Industry," was a hot topic at SEMI's Industry Strategy Symposium (ISS) conference on January 11.

01/18/2017  AGC Asahi Glass (AGC), a manufacturer of glass, chemicals and high-tech materials, today announced it has developed a diverse line of glass substrates specifically designed for semiconductor packaging applications and semiconductor manufacturing process support.

01/17/2017  Dr. Rhines is being recognized for leadership and technology innovation in integrated circuit design and automation.

01/17/2017  Dow Corning significantly expanded the design flexibilities for LED packaging manufacturers today with the addition of three new highly reflective silicone coatings to its fast-growing portfolio of advanced LED solutions.

01/13/2017  This week, Future Market Insights (FMI) releases its latest report on the semiconductor assembly and testing services market.

01/13/2017  IBM this week announced new, all-flash storage solutions designed for midrange and large enterprises, where high availability, continuous up-time, and performance are critical.

01/12/2017  Toshiba America Electronic Components, Inc. this week announced the launch of its JEDEC e-MMCTM Version 5.1-compliant embedded NAND flash memory products that feature an enhanced operational temperature range of -40°C to +105°C.

01/12/2017  X-Fab, SMIC, and TowerJazz each grew by ?30% last year.

01/09/2017  Solid upside potential for DRAM, flash memory markets in 2017 and much of forecast period.

01/09/2017  ON Semiconductor announced a collaboration with Hexius Semiconductor to qualify several of their analog intellectual property (IP) blocks in its popular ONC18 0.18 µm CMOS process.

01/06/2017  The Delivery Systems and Services Group (DS&S) of Versum Materials, Inc. (NYSE: VSM) has realized an important milestone: the sale and commissioning of its 200th CHEMGUARD Gen III high purity, liquid delivery system since the product line launched in early 2016.

01/05/2017  Imagine a dim light which is insufficiently bright enough to illuminate a room. An amplifier for such a light would increase the brightness by increasing the number of photons emitted. Photonics researchers have created such a high gain optical amplifier that is compact enough to be placed on a chip. The developed amplifier would help to efficiently increase the power of the transmitted light before it is completely depleted through optical losses.

01/05/2017  Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits, to be held at the Rihga Royal Hotel in Kyoto, Japan from June 5 - 8, 2017.