01/04/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $31.0 billion for the month of November 2016, an increase of 7.4 percent compared to the November 2015 total.

01/04/2017  Emerging devices can enhance conventional device sales.

12/27/2016  In order to maximize the profitability of an IC manufacturer’s new process node or product introduction, an early and fast yield ramp is required. Key to achieving this rapid yield ramp is the ability to provide quality and actionable data to the engineers making decisions on process quality and needed improvements.

12/23/2016  From the ground-breaking research breakthroughs to the shifting supplier landscape, these are the stories the Solid State Technology audience read the most during 2016.

12/21/2016  TDK Corporation and Tronics Microsystems SA jointly announced today that the all-cash public tender offer launched by TDK’s wholly-owned subsidiary EPCOS AG (“EPCOS”) was successfully closed on December 14, 2016.

12/21/2016  Analysts see another chance for Silicon-on-Insulator technology, as proponents claim technical and cost advantages for fully-depleted SOI.

12/21/2016  A new approach to bump height measurements uses an interferometric technique to accurately measure bump height and PL thickness.

12/21/2016  Researchers from IBM and GlobalFoundries will report on the first use of "air-gaps" as part of the dielectric insulation around active gates of "10nm-node" finFETs at the upcoming International Electron Devices Meeting (IEDM) of the IEEE.

12/19/2016  Data from SEMI’s recently updated World Fab Forecast report reveal that 62 new Front End facilities will begin operation between 2017 and 2020.

12/16/2016  Reliance on existing wafer sizes increases as outlook for 450mm wafers fades.

12/16/2016  GLOBALFOUNDRIES today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic.

12/16/2016  A book-to-bill of 0.96 means that $96 worth of orders were received for every $100 of product billed for the month.

12/15/2016  Embedded die in substrate platform has its own history and adoption scheme compared to other advanced packaging platforms.

12/14/2016  Amkor Technology, Inc. today announced completion of product qualification for its innovative new Silicon Wafer Integrated Fan-Out Technology (SWIFT).

12/14/2016  SEMI today announced the lineup for six forums at SEMICON China and FPD China held at the Shanghai New International Expo Centre on March 14-16, 2017.

12/13/2016  SEMI today reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 8.7 percent to $39.7 billion in 2016.

12/09/2016  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2016 GSA Awards Dinner Celebration that took place in Santa Clara, California.

12/09/2016  Mentor Graphics Corporation today announced the winners of its second annual Don Miller Award for Excellence in System-Level Thermo-Fluid Design.

12/08/2016  The global semiconductor market has rebounded in recent months, with October marking the largest year-to-year sales increase since March 2015.

12/07/2016  “We’ve been seeing a steady increase in market interest and sales,” said ClassOne Technology President, Kevin Witt.