10/14/2016  Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator), announces that the UltraCMOS PE42723 high linearity RF switch has won an ECN IMPACT Award in the market disruptor category.

10/13/2016  SEMICON Europa 2016, opening in less than two weeks in Grenoble, will explore the issues facing Europe's semiconductor and electronics industries, including processes, materials, equipment and supply chain.

10/13/2016  Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in Mainland China, today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.

10/12/2016  Murata Manufacturing Co., Ltd. and IPDiA S.A. today announced that Murata Electronics Europe B.V., a wholly-owned subsidiary of Murata is about to acquire IPDiA, a 3D silicon capacitor technology developer headquartered in France, and IPDiA will become a subsidiary of Murata.

10/11/2016  Dual-ion batteries (DIBs) are a new type of battery developed in recent years, typically using graphite as both the cathode and anode material.

10/10/2016  Mentor Graphics Corporation today announced that it has acquired Galaxy Semiconductor, a provider of test data analysis and defect reduction software for the semiconductor industry.

10/07/2016  The company announced today that it has leased a former Qualcomm-owned manufacturing facility in Silicon Valley and will relocate its current US headquarters and NFC Innovation Center in the first quarter of 2017.

10/07/2016  Scientists have created a material that could make reading biological signals, from heartbeats to brainwaves, much more sensitive.

10/06/2016  This year again, both market segments, high end and low end, are the main targets of the TSV technologies providers.

10/06/2016  In the quest for faster and more powerful computers and consumer electronics, big advances come in small packages.

10/06/2016  The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating.

10/05/2016  Today, SEMI announced an exceptional lineup of keynotes at SEMICON Japan's "SuperTHEATER" focusing on innovation and insights into the future of the electronics supply chain.

10/03/2016  Silicon Labs today announced the acquisition of Micrium, a supplier of real-time operating system (RTOS) software for the Internet of Things (IoT).

10/03/2016  Mentor Graphics Corporation today announced that it has joined the Wide Band Gap integration (WBGi) power electronics consortium to participate in thermal management and power cycling initiatives.

09/29/2016  As the rate of traditional scaling slows, the chip sector looks increasingly to materials and design to move forward on multiple paths for multiple applications. Figuring out more effective ways to collaborate across silos will be crucial.

09/28/2016  Synopsys, Inc. today announced that TSMC is recognizing Synopsys with three "2016 Partner of the Year" awards for Interface IP and joint development of 7-nanometer (nm) mobile and HPC design platforms.

09/28/2016  Silicon-proven and optimized IP from INVECAS is now available for foundry customers on GLOBALFOUNDRIES' 14LPP process.

09/26/2016  The advanced semiconductor summit will take place on 23-25 January, 2017 at Minatec in Grenoble, France, with the theme "European 3D Summit 2017 – Creating High Density Systems."

09/22/2016  Synopsys, Inc. today announced a collaboration with TSMC to complete the certification for its 16-nanometer (nm) FinFET Compact (16FFC) process for a suite of Synopsys' digital, custom and signoff tools from the Galaxy Design Platform.

09/21/2016  Key features of the cell structure, design and integration of the Micron 3D 32L FG-NAND device are discussed, and compared with Samsung’s 32L and 48L V-NAND device.