09/21/2016  At the 2016 ECTC Conference, TSMC discussed their UFI (UBM-Free Integration) Fan-In WLCSP technology which they claim enables large die fine pitch packages.

09/21/2016  The semiconductor industry is changing in some big ways. Demand for PCs and mobile devices – once the main drivers of growth – has slowed.

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

09/20/2016  Toshiba America Electronic Components, Inc. has expanded its family of 24nm single-level cell (SLC) NAND flash memory solutions.

09/20/2016  Ted Shafer of ASML reports on the highlights from the ?200mm manufacturing session during SEMICON West, organized by the SEMI Secondary Equipment and Applications Special Interest Group.

09/19/2016  The organizations will expand the scope of their R&D collaboration to focus on advancing Fan-Out Wafer-Level Packaging (FOWLP), a key technology inflection expected to help make chips and end-user devices smaller, faster and more power efficient.

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

09/16/2016  Nordson Corporation today announced it plans to combine its existing screw and barrel operations in Youngstown, Ohio; New Castle, Pennsylvania; and Pulaski, Virginia into a single expanded manufacturing center of excellence in Austintown, Ohio.

09/15/2016  This technology provides more processing power for data centers, networking, premium mobile processors, and deep learning applications.

09/15/2016  High-performance embedded non-volatile memory solution is ideally suited for emerging applications in advanced IoT and automotive.

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.

09/14/2016  Government/Military only end-use segment where Asia-Pacific does not have top IC marketshare.

09/13/2016  SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts.

09/08/2016  GLOBALFOUNDRIES today unveiled a new 12nm FD-SOI semiconductor technology, extending its leadership position by offering the industry's first multi-node FD-SOI roadmap.

09/08/2016  GLOBALFOUNDRIES today announced a new partner program, called FDXcelerator, an ecosystem designed to facilitate 22FDX system-on-chip (SoC) design and reduce time-to-market for its customers.

09/02/2016  Stretchable, flexible, reliable memory device inspired by the brain.

09/01/2016  For many years, the ATE industry has been challenged with controlling the cost of both production and development test by implementing innovative approaches and employing clever strategies (e.g., multi-site test implementation, DFT, etc.) to make “ends” meet, so to speak.

09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

08/31/2016  A novel 'plastic crystal' developed by Hokkaido University researchers has switching properties suitable for memory-related applications.

08/29/2016  A research team led by Professor Keon Jae Lee from the Korea Advanced Institute of Science and Technology (KAIST) and by Dr. Jae-Hyun Kim from the Korea Institute of Machinery and Materials (KIMM) has jointly developed a continuous roll-processing technology that transfers and packages flexible large-scale integrated circuits.