08/29/2016  According to the latest market study released by Technavio, the global front-end-of-the-line semiconductor equipment market recorded a revenue of over $22 billion in 2015 and this growth is expected to exceed $24 billion in 2020.

08/26/2016  Littelfuse, Inc. today announced it has entered into definitive agreements to acquire the product portfolio of transient voltage suppression diodes, switching thyristors and insulated gate bipolar transistors for automotive ignition applications from ON Semiconductor Corporation for a combined purchase price of $104 million.

08/26/2016  Edwards Vacuum has been recognized as one of ten companies receiving a 2016 Supplier Excellence Award from Lam Research Corp.

08/24/2016  A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

08/24/2016  North America-based manufacturers of semiconductor equipment posted $1.79 billion in orders worldwide in July 2016 (three-month average basis) and a book-to-bill ratio of 1.05.

08/23/2016  2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC, changed the game and may create a trend of acceptance of Fan-Out packages

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

08/23/2016  Microsemi Corporation today announced it is renewing its current 50,000 euros scholarship program for University of Limerick engineering students living in County Clare, where the company has its European headquarters in Ennis, Ireland.

08/22/2016  Researchers at Queen's University Belfast and ETH Zurich, Switzerland, have created a new theoretical framework which could help physicists and device engineers design better optoelectronics.

08/19/2016  ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

08/19/2016  Innodisk unveiled its Next Generation innovation in flash storage design technology last week during its VIP product launch at the Hyatt Hotel in Santa Clara, CA.

08/17/2016  SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.

08/16/2016  Reno Sub-Systems today announced that it has secured its first platform design win for its Electronically Variable Capacitor (EVC) matching network.

08/16/2016  Problems frequently arise as a result of an incomplete or absent formal risk assessment when processes are modified or new materials introduced.

08/16/2016  New wafer processing technologies overcome FOWLP’s technical hurdles, paving the way for a new generation of ultra compact, high I/O electronic devices.

08/15/2016  Semiconductor processes have long been a mystery for many circuit designers. They didn’t need to worry about how chips were fabricated most of the time, thanks to the many EDA innovations that make their jobs easier and complex designs possible.

08/15/2016  Mentor Graphics Corporation today announced the first phase of the new Xpedition printed circuit design (PCB) flow to address the increasing complexity of today's advanced systems designs.

08/12/2016  Samsung Electronics Co., Ltd. this week introduced a blueprint for next-generation flash memory solutions that will meet the ever-increasing demands of big data networks, cloud computing and real-time analysis.

08/12/2016  ChipMOS TECHNOLOGIES (Bermuda) LTD. a provider of outsourced semiconductor assembly and test services, today announced that its shareholders have approved the merger of ChipMOS with and into ChipMOS TECHNOLOGIES INC.

08/11/2016  Cypress Semiconductor Corporation today announced that Hassane El-Khoury has been named its president, chief executive officer, and a member of its board of directors.