07/07/2016  Mentor Graphics Corp. today announced that on June 15, 2016, the company's shareholders elected Dr. Cheryl L. Shavers to the company's board of directors.

07/06/2016  EV Group (EVG) today introduced new capabilities on the EVG ComBond automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices

07/05/2016  Assuring IoT security will require strategies to manage the entire value and supply chains.

07/01/2016  Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC), a designer and manufacturer of semiconductor and LED assembly equipment, has joined A*STAR’s Institute of Microelectronics (IME)’s Chip-on-Wafer Consortium II, together with other major industry players.

07/01/2016  AMICRA Microtechnologies, a German-based vendor of advanced back-end assembly processing equipment for advanced packaging applications, has received an order for the AFC Plus System from Fabrinet West.

06/30/2016  The Strategic Materials Conference (SMC 2016), focusing on "Scaling Challenges: The Future of Materials and Packaging," will be held September 20-21, at the Computer History Museum in Mountain View, Calif.

06/30/2016  A*STAR’s Institute of Microelectronics (IME) has partnered semiconductor companies to develop cost-effective solutions in 2.5D and 3D wafer-level integrated circuit (IC) packaging.

06/29/2016  ALLVIA, Inc. has expanded its capacity into glass and quartz via manufacturing to accommodate customer requests in via-fill technology from silicon interposers to glass and quartz interposers.

06/28/2016  A Clarkson University research team reports surprising findings that could have significant impact for constructing nano-patterned materials in electronic, magnetic or optical devices.

06/28/2016  Ultratech's AP300 lithography systems will be used for next-generation, high-volume, fan-out wafer-level packaging applications.

06/24/2016  With a surface resembling that of plants, solar cells improve light-harvesting and thus generate more power.

06/24/2016  In the early stages of development, having more process control can help reduce both the number and duration of cycles-of-learning (the iterations required to solve a particular problem).

06/23/2016  According to the latest market research report by Technavio, the global semiconductor capital equipment market is expected to reach $47.34 billion mark by 2020.

06/23/2016  For fan-out wafer-level packaging and 3D packaging, thin wafer handling is critical; the wafer must not warp, bend or shift during any wafer-processing steps.

06/22/2016  Greater demand for energy efficiency in systems, cars, portable electronics, and new connections to the Internet of Things will steadily drive power transistor sales to new record-high levels in the next three years.

06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

06/21/2016  Amkor Technology Inc., a provider of semiconductor packaging and test services, today announced it has received the Supplier of the Year award from Qualcomm Technologies, Inc.

06/21/2016  The LSA101 tool will be used to support the foundry's 28nm and 40nm production efforts, and Ultratech expects to ship the system in the third quarter of 2016.

06/21/2016  EV Group (EVG) today announced that, for the fourth successive year, it has earned all three awards resulting from VLSIresearch Inc.'s annual Customer Satisfaction Survey.

06/21/2016  Papers that address the theme "Inflections for a Smart Society" are highlighted.