05/11/2016  EV Group (EVG) announced that it has received multiple orders for its GEMINI FB XT automated fusion wafer bonders from multiple leading device manufacturers.

05/11/2016  William (Bill) P. Sullivan, currently a member of Maxim's Board, will assume the Board Chair position, effective immediately.

05/11/2016  Worldwide semiconductor capital spending is projected to decline 2 percent in 2016, to $62.8 billion, according to Gartner, Inc. This is up from the estimated 4.7 percent decline in Gartner's previous quarterly forecast.

05/11/2016  Reflects strong demand for eWLB in mobile market with accelerating adoption in Internet of Things, wearables, MEMS and automotive applications.

05/10/2016  Falling ASPs offset strong unit growth in automotive IC market, resulting in 3% decline.

05/10/2016  Rudolph Technologies, Inc. is pleased to announce the appointment of Debbora Ahlgren as vice president of global customer operations, leading the company’s sales and service organization.

05/06/2016  Advanced Semiconductor Engineering, Inc. and Deca Technologies, a subsidiary of Cypress Semiconductor Corp., announced the signing of an agreement whereby ASE will invest $60 million in Deca and will license Deca's M-Series Fan-out Wafer-Level Packaging (FOWLP) technologies and processes.

05/06/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.

05/05/2016  Tessera Technologies, Inc. announced today that its wholly owned subsidiary Invensas Corporation signed a new technology license and development agreement with Advanced Semiconductor Engineering, Inc.

05/05/2016  North America has a long and rich history of semiconductor manufacturing and innovation.

05/04/2016  SEMI today announced the appointment of Melissa Grupen-Shemansky, Ph.D., as Chief Technology Officer (CTO) for the FlexTech Group and for SEMI’s Advanced Packaging program.

05/04/2016  FemtoMetrix, a developer of non-destructive optical inspection systems, announced today that it has entered into a patent and technology license agreement with The Boeing Company.

05/04/2016  Together, this group will ensure alignment and consensus across a range of stakeholders to identify trends and develop the roadmap for all of the related technologies in the computer industry.

05/03/2016  SEMI today announced the SEMICON West 2016 program agenda with a focus on today’s issues facing the future of semiconductor manufacturing.

05/02/2016  According to the latest research study released by Technavio, the global semiconductor stepper system market is expected to reach over USD 6 billion by 2020.

04/29/2016  The world’s leading lithographers gather each year in San Jose, California at SPIE’s Advanced Lithography conference to discuss how to extend optical lithography. So of all the NGL technologies, which will win out in the end?

04/29/2016  Research and Markets’ recent report, "Global Semiconductor Packaging Materials Market 2016-2020", expects the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period of 2016-2020.

04/27/2016  Cartamundi, imec and Holst Centre (set up by imec and TNO) are proud to announce to have just won the "Best Product" - Award at Printed Electronics Europe for their ultra-thin plastic RFID technology integrated into Cartamundi's playing cards.

04/26/2016  Without Apple, TSMC’s 2015 foundry sales would have dropped by 2% as compared to a 6% increase.

04/25/2016  SEMI today announced the second annual edition of the SEMI European MEMS Summit, dedicated to MEMS and sensors, to be held on September 15-16.