04/25/2016  Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that, Geoff Ribar, senior vice president and chief financial officer, who joined the company in 2010, has decided to retire from Cadence effective March 31, 2017.

04/22/2016  Order activity remains steady and is on par with both the previous quarter and one year ago.

04/20/2016  Park Systems announced today the appointments of Charlie Park as Senior Vice President of Global Sales, and Jong-Pil Park as Vice President of Production.

04/20/2016  In a global industry, monitoring regulatory developments across different regions can be a challenge.

04/20/2016  Working in collaboration with colleagues around the country, University of Wisconsin-Madison engineers have pioneered a unique method that could allow manufacturers to easily and cheaply fabricate high-performance transistors with wireless capabilities on huge rolls of flexible plastic.

04/20/2016  Program unveiled for 2016 Symposia on VLSI Technology & Circuits – includes short courses, focus sessions, and panel discussions on "Inflections for a Smart Society" theme.

04/19/2016  Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced today that Sandia National Laboratories signed a new license agreement for ZiBond and Direct Bond Interconnect (DBI) technologies.

04/19/2016  Cellphone App MPUs and Signal Conversion top the list; Tablet MPU growth stalls, DRAM tumbles.

04/18/2016  Leading innovators in today's integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016 on July 12-14 in San Francisco, Calif.

04/15/2016  The 62nd annual IEEE International Electron Devices Meeting (IEDM), to be held at the San Francisco Union Square Hilton hotel December 3 - 7, 2016, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

04/14/2016  To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies.

04/13/2016  Imec, the nanoelectronics research center, today announced that its annual Imec Technology Forum (ITF) in Brussels will take place May 24-25, 2016 in Brussels, Belgium at SQUARE, Brussels Meeting Centre

04/13/2016  While much of the recent attention has been focused on the growth of wafer level packages (WLPs), specifically fan-out WLPs, this is not the only segment forecast to undergo strong unit growth.

04/12/2016  Micron Technology, Inc. today announced a new portfolio of PCIe solid state drives (SSDs) that leverage the high-performance NVMe protocol.

04/12/2016  IHS forecasts that the IoT market will grow from an installed base of 15.4 billion devices in 2015 to 30.7 billion devices in 2020 and 75.4 billion in 2025.

04/12/2016  Leti, an institute of CEA Tech, today announced the continuation of its collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop CoolCube.

04/08/2016  Molex, a global manufacturer of electronic solutions, announced today the acquisition of Interconnect Systems, Inc. ("ISI") which specializes in the design and manufacture of high density silicon packaging with advanced interconnect technologies.

04/08/2016  The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in consumer electronics sector.

04/07/2016  Rudolph Technologies, Inc. today announced the availability of new, high-speed 3D metrology on its flagship NSX Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects.

04/07/2016  SEMI, the global industry association serving the electronics manufacturing supply chain, will include programs pertinent to Vietnam’s semiconductor industry at the upcoming SEMICON SEA 2016, the region’s premier showcase for microelectronics innovation.