Packaging

PACKAGING ARTICLES



TowerJazz completes acquisition of Maxim's San Antonio fabrication facility

02/02/2016  TowerJazz, the global specialty foundry leader, announced today that it completed its previously announced acquisition of an 8-inch wafer fabrication facility in San Antonio, Texas, United States from Maxim Integrated Products, Inc.

Global semiconductor sales top $335B in 2015

02/01/2016  The Semiconductor Industry Association (SIA) today announced the global semiconductor industry posted sales totaling $335.2 billion in 2015, a slight decrease of 0.2 percent compared to the 2014 total, which was the industry's highest-ever sales total.

Epiluvac and SAMCO collaborate to offer processing equipment for WBG materials in Nordic countries

02/01/2016  Sweden-based SiC CVD developer and manufacturer Epiluvac AB has entered into a collaboration with SAMCO, a semiconductor process equipment developer and manufacturer based in Japan, in which Epiluvac will introduce new clients to SAMCO in Sweden, Norway, Finland and Denmark.

Foundries takeover 200mm fab capacity by 2018

02/01/2016  IoT drives worldwide 200mm fab capacity in 2018 back to 2006 levels.

Growing application of semiconductor ICs in the IoT driving global packaging and assembly equipment market

01/28/2016  Technavio analysts forecast the global semiconductor packaging and assembly equipment market to post a CAGR of 4.7% by 2020, according to their latest report.

Samsung, Apple continue to lead as top global semiconductor customers

01/27/2016  Samsung Electronics and Apple remained the top semiconductor buyers in 2015, representing 17.7 percent of the market, according to Gartner, Inc.

North American semiconductor equipment industry posts December 2015 book-to-bill ratio of 0.99

01/27/2016  A book-to-bill of 0.99 means that $99 worth of orders were received for every $100 of product billed for the month.

China semiconductor acquisitions surge; SEMICON China brings the new market into focus

01/26/2016  During SEMICON China 2016 on March 15-17 in Shanghai, key government decision makers, IC fund managers, and global industry analysts will share their insights on China's IC manufacturing policy.

SEMICON Korea opening: Memory and mobility drive IC manufacturing

01/26/2016  SEMICON Korea 2016 at COEX in Seoul opens tomorrow with more than 540 exhibiting companies and an expected 40,000 attendees.

Cornell-led team creates gallium nitride power diode

01/22/2016  Making tiny switches do enormous jobs in a more efficient way than current technology allows is one of the goals of a research team led by Cornell engineering professor Huili (Grace) Xing.

2016 Critical Materials Council (CMC) Seminar – Call for Papers

01/21/2016  The Critical Materials Council (CMC) and TECHCET have issued a call for papers to be presented at the “Critical Materials for Device Driven Scaling” Seminar to be held May 5-6, 2016 in Hillsboro, Oregon, USA.

Microsemi launches PIN diode switch element

01/21/2016  Microsemi Corporation today announced a new high power monolithic microwave surface mount (MMSM) series-shunt SP2T PIN diode reflective switch.

Cypress supports wafer sales on leading F-RAM and nvSRAM Portfolio

01/21/2016  Cypress Semiconductor Corp., today announced the addition of wafer products to its industry-leading nonvolatile random access memory (NVRAM) portfolio.

Semiconductor R&D growth slows in 2015

01/21/2016  Industry-wide R&D expenditures grew 0.5% to a record-high $56.4 billion in 2015. Top 10 R&D spenders collectively increased expenditures by nearly 2% in the year.

Worldwide device shipments to grow 1.9% in 2016, while end-user spending to decline for the first time

01/20/2016  Worldwide combined shipments of devices (PCs, tablets, ultramobiles and mobile phones) are expected to reach 2.4 billion units in 2016 , a 1.9 percent increase from 2015, according to Gartner, Inc.

Gartner analysts reveal unexpected implications arising from the Internet of Things

01/19/2016  More than half of major new business processes and systems will incorporate some element of the Internet of Things (IoT) by 2020, according to Gartner, Inc.

Smart Equipment Technology joins IRT Nanoelec 3D Integration Program

01/15/2016  Will work with Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies using direct Cu-Cu bonding

Qualcomm and TDK announce joint venture

01/14/2016  Qualcomm and TDK to expand their collaboration across multiple technologies.

SEMI Awards honor process and technology integration achievements

01/14/2016  SEMI announced the recipients of the 2015 SEMI Awards for the Americas.

Gartner reports worldwide PC shipments declined 8.3% in fourth quarter of 2015

01/13/2016  Worldwide PC shipments totaled 75.7 million units in the fourth quarter of 2015, a 8.3 percent decline from the fourth quarter of 2014, according to preliminary results by Gartner, Inc




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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