12/15/2015  SEMI projects that worldwide sales of new semiconductor manufacturing equipment will decrease 0.6 percent to $37.3 billion in 2015.

12/15/2015  Applied Materials, Inc. today announced that Dr. Chorng-Ping Chang, who leads the company's strategic external research with universities and industry consortia, has been named a 2016 IEEE Fellow.

12/14/2015  SEMICON Japan 2015, an exhibition in Asia for semiconductor manufacturing and related processing technology, opens tomorrow at Tokyo Big Sight.

12/14/2015  After deflated 2015, 3D leads the way.

12/11/2015  SEMI this week reported that worldwide semiconductor manufacturing equipment billings reached US$9.6 billion in the third quarter of 2015.

12/11/2015  SEMI this week announced details about the fourth annual European 3D Summit.

12/11/2015  The total production value of electronic systems is forecast to decrease 2% in 2015 to an estimated $1,423 billion, marking only the fourth time in history that the systems market registers a decline.

12/09/2015  At this week’s IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm.

12/09/2015  Worldwide semiconductor fab equipment capital expenditure growth (new and used) for 2015 is expected to be 0.5 percent (total capex of US$35.8 billion), increasing another 2.6 percent (to a total of $36.7 billion) in 2016, according to the latest update of the quarterly SEMI World Fab Forecast report.

12/09/2015  At this week’s IEEE International Electron Devices Meeting 2015, nano-electronics research center imec presented breakthrough results to increase performance and improve reliability of deeply scaled silicon CMOS logic devices.

12/08/2015  It is possible to fabricate copper pillars more than 100?m in height, with aspect ratios up to 6:1, using advanced packaging stepper lithography in conjunction with electroplating.

12/08/2015  Subtleties in thicknesses between the alternating Cu metal and dielectric layers within a build-up substrate can impact BLR performance.

12/08/2015  CEA-Leti today announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed at the same, or lower, power consumption, and improve performance.

12/07/2015  CEA-Leti today announced preliminary steps for demonstrating a quantum bit, or qubit, the building block of quantum information, in a process utilizing a silicon-on-insulator (SOI) CMOS platform.

12/07/2015  CEA-Leti today announced it has signed an agreement with Keysight Technologies, a device-modeling software supplier, to adapt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation.

12/07/2015  Market projected to grow by 0.2 percent in 2015, 1.4 percent in 2016, and 3.1 percent in 2017.

12/03/2015  Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020.

12/03/2015  Sales of top 10 IDMs forecast to be flat; top 10 fabless companies expected to slip into negative growth this year.

12/02/2015  SEMI Foundation, created by global industry association SEMI to support education and career awareness in the field of high-tech, has announced the appointment of Leslie Tugman as its executive director.

12/01/2015  GaN Systems, a manufacturer of gallium nitride power transistors, announces that its foundry, Taiwan Semiconductor Manufacturing Corporation (TMSC), has expanded the high volume production of products based on GaN System’s proprietary Island Technology by 10X in response to surging global demand from consumer and enterprise customers.