12/01/2015  One of the plenary presentations at this year’s IEEE 3DIC conference was “Advanced 2.5D/3D Hetero-Integration Technologies at GINTI, Tohoku University” by KW Lee, Koyanagi-san and co-workers, detailing the activities at the University and the prototyping spin-out.

11/30/2015  This year, the Justus Liebig University Giessen awards its Röntgen Prize to Dr. Eleftherios Goulielmakis.

11/25/2015  Mentor Graphics Corp. announced it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform, including the RealTime Designer physical RTL synthesis solution and Olympus-SoC place & route system, for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.

11/24/2015  A privately held company founded in 1998 and based near London, Telegesis has established itself as a ZigBee expert with strong momentum in the smart energy market, providing ZigBee module solutions to many of the world’s top smart metering manufacturers.

11/23/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with 8 co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

11/20/2015  North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in October 2015 (three-month average basis) and a book-to-bill ratio of 0.98.

11/19/2015  IDTechEx Printed Electronics USA 2015, held in Santa Clara, CA Nov 18-19, is one mega conference with eight co-located tracks ranging from sensor technology & wearables to IoT, energy harvesting & storage to electric vehicles, 3D printing and graphene.

11/19/2015  Today, SEMI announced details about the SEMI Industry Strategy Symposium (ISS) on January 10-13 where semiconductor executives will discuss ?Integrating for Growth: Markets, Technology, and Ecosystem? in Half Moon Bay, Calif.

11/18/2015  CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms.

11/18/2015  A team from Jülich and Aachen has now found a way to control the desired conducting properties of this type of material more precisely and reliably than ever before.

11/17/2015  Is there any question that TCB is real and will be the next big bonding technology? The focus this month is more on this very important new assembly process from Intel and ASM.

11/17/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

11/17/2015  Vacuum technology trends can be seen over the period of innovation defined by Moore’s Law, particularly in the areas of increasing shaft speed, management of pumping power, and the use computer modeling.

11/17/2015  Recent trends and future directions for wafer bonding are reviewed, with a focus on MEMS.

11/16/2015  Researchers from RMIT University in Melbourne have helped crack the code to ultra-secure telecommunications of the future in an international research project that could also expedite the advent of quantum computing.

11/13/2015  The theme for the January 27 through 29 exhibition at Seoul’s COEX is “Connect to the Future – Markets, Technology, and People.”

11/13/2015  Systematic – and predictive – cost reduction in semiconductor equipment manufacturing

11/13/2015  Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

11/13/2015  The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

11/12/2015  Method analyzes non-uniform conductors with a magnetic field.