11/11/2015  Ultratech, Inc. today introduced the Superfast 4G+ in-line, 3D topography inspection system.

11/10/2015  A recent report from Navigant Research suggests the global market for residential IoT devices will grow strongly through 2025.

11/10/2015  New research suggests wrapping silver nanowires with an ultrathin layer of graphene protects the structures from damage and could represent a key to realizing their commercial potential.

11/06/2015  GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD products using its most advanced 14nm FinFET process technology.

11/05/2015  With the emergence of the IoT (Internet of Things), advanced packaging is clearly the enabling technology providing solutions for mobile applications and for semiconductor devices fabricated at 16 nm and below process nodes.

11/04/2015  Allegro MicroSystems announced the release of a dual-channel Hall-effect latch featuring two-dimensional (2D) sensing via a combination of vertical Hall and planar Hall elements.

11/03/2015  FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

11/03/2015  FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

11/03/2015  DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

11/03/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

11/03/2015  Plasma-Therm announced that it has acquired a High Density Radical Flux plasma technology that enables low-temperature Bosch polymer removal.

11/03/2015  Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports.

11/02/2015  X-FAB Silicon Foundries announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies.

10/30/2015  Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.

10/30/2015  Soraa announced that it will open a new semiconductor fabrication plant in Syracuse, New York.

10/30/2015  Texas Instruments (Maxim Integrated) and STMicro (Fairchild) may be considering large acquisitions.

10/28/2015  InvenSense announced it has released for OEM review UltraPrint, its ultrasonic fingerprint imaging solution, manufactured on the proprietary InvenSense CMOS-MEMS Platform (ICMP).

10/28/2015  Nordson EFD introduces a new series of pneumatic non-contact dispensing systems.

10/27/2015  mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

10/27/2015  Integrated Device Technology, Inc. announced an agreement to acquire privately held ZMDI for total consideration of $310M in cash.