Packaging

PACKAGING ARTICLES



Monolithic 3D - Game-Changing 2.0 at IEEE S3S

10/05/2015  The path to alternative scaling is now open.

LG Innotek announces high power LED packages

10/01/2015  LG Innotek announced that the company started to produce high-power LED packages (H35C4 Series) featuring 180lm/W.

TSMC forum emphasizes industry collaboration

10/01/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

Novati Technologies launches advanced integrated sensor platform

09/30/2015  Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto multi-layer stacks of wafers in order to consume less power and perform significantly faster while reducing overall footprint.

2015 IEEE International Electron Devices meeting to showcase the latest technology developments in micro/nanoelectronics

09/30/2015  At the 61st annual IEEE International Electron Devices Meeting (IEDM) subjects under discussion will encompass a range of topics critical to the continuing progress of the industry.

Advantest and D2S partner to tackle CD uniformity errors for advanced photomasks

09/29/2015  D2S announced that it has partnered with Advantest to integrate D2S' Wafer Plane Analysis engine into Advantest's Mask MVM-SEM (Multi Vision Metrology Scanning Electron Microscope) systems.

Rudolph acquires inspection technology of Stella Alliance, LLC

09/29/2015  Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

Hillcrest Labs unveils MotionEngine Wear software

09/29/2015  Hillcrest Labs unveiled its MotionEngine (TM) Wear software with always-on, sensor-enabled features optimized for the latest generation of wearable devices.

2016 Symposia on VLSI Technology and Circuits announces call for papers

09/28/2015  The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

ULVAC launches G-TRAN series multi ionization gauge ST2

09/28/2015  ULVAC, Inc. announced that the company has developed G-TRAN series multi ionization gauge ST2, a transducer-type ionization vacuum gauge.

ams offers truly scalable transistors in High-Voltage CMOS

09/28/2015  The Full Service Foundry division of ams AG today announced a further expansion of its industry-leading 0.35µm High-Voltage CMOS specialty process platform.

X-FAB sets benchmark for low-noise CMOS

09/25/2015  Enhanced XH035 and XH018 CMOS transistors deliver industry-leading performance for highly noise-sensitive applications.

Permanent data storage with light

09/24/2015  The first all-optical permanent on-chip memory has been developed by scientists of Karlsruhe Institute of Technology (KIT) and the universities of Münster, Oxford, and Exeter.

UMC enters high volume touch IC production using foundry industry's first 0.11um eFlash process

09/24/2015  United Microelectronics Corporation (UMC), a global semiconductor foundry, today announced that it has entered high volume production for touch IC applications manufactured on UMC's 0.11um eFlash process.

Europe's secondary industry in the spotlight

09/22/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

Dialog Semiconductor to acquire Atmel for $4.6 billion

09/21/2015  Dialog Semiconductor and Atmel Corporation announced today that Dialog has agreed to acquire Atmel in a cash and stock transaction for total consideration of approximately $4.6 billion.

Process Watch: Risky business

09/18/2015  This is the ninth in a series of 10 installments that explore certain fundamental truths about process control--defect inspection and metrology--for the semiconductor industry.

S3S - the conference for IoT technologies

09/18/2015  The upcoming IEEE S3S Conference 2015 in Sonoma, CA, on October 5-8, will focus on key technologies for the IoT era.

2015 International Conference on Planarization/CMP Technology (ICPT 2015)

09/16/2015  September 30 - October 2, 2015, Wild Horse Pass Hotel & Casino, Chandler, AZ, USA. ICPT 2015 provides the largest forum for academic researchers, industrial practitioners and engineers from around the world dedicated to the exchange of information on the state-of-the-art in Chemical Mechanical Polishing (CMP) and other planarization technologies.

OEM Group Announces New Cintillio-S (TM) Automated Batch Wet Chemical Processing System

09/14/2015  Global semiconductor capital equipment manufacturer OEM Group announced today that it has launched its new Cintillio-S (TM) automated batch wet chemical processing system.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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