Packaging

PACKAGING ARTICLES



Realizing carbon nanotube integrated circuits

09/09/2015  Encapsulation layers keep carbon nanotube transistors stable in open air.

ClassOne Technology names Kevin Witt Chief Technology Officer

09/09/2015  Semiconductor equipment manufacturer ClassOne Technology has today announced the appointment of Kevin Witt to the position of Chief Technology Officer.

Intersil acquires Great Wall Semiconductor

09/09/2015  Intersil Corporation, a provider of innovative power management and precision analog solutions, today announced the acquisition of Great Wall Semiconductor.

Semiconductor Research Corporation expands benchmarking research program

09/09/2015  Marking an industry first for emerging electronics devices, Semiconductor Research Corporation (SRC) today announced a significant expansion of its benchmarking research.

ASE Chairman Jason Chang receives SEMI award for advancements of copper wire bonding technology

09/08/2015  The SEMI award recognizes Jason’s significant achievements in the development and commercialization of copper wire in the IC assembly process.

Nordson Corporation announces acquisition of MatriX Technologies GmbH

09/04/2015  Nordson Corporation today announced it has acquired Munich, Germany-based MatriX Technologies GmbH, a manufacturer of automated X-ray inspection (AXI) equipment used to ensure the quality of electronic printed circuit boards, critical electronic devices and fully assembled products in consumer, automotive and other industrial end markets worldwide.

Key industry leaders join The ConFab Advisory Board

09/04/2015  Solid State Technology is thrilled to announce that several key industry leaders have joined the Advisory Board for its annual conference and networking event, The ConFab.

Global semiconductor sales down slightly in July

09/04/2015  Softening demand, currency devaluation lead to slower sales.

QEOS and GLOBALFOUNDRIES to offer industry’s first CMOS platform for millimeter-wave markets

09/04/2015  QEOS, Inc., a designer of connectivity and sensing CMOS millimeter-wave (mmWave) solutions, and GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced they are partnering to co-develop the industry’s first mmW CMOS platform.

Asia-Pacific to dominate IC sales across system categories in 2015

09/04/2015  Europe to remain largest regional market for auto ICs, but Asia-Pacific gaining fast.

Automotive industry now the third largest end market for power semiconductors

09/03/2015  In 2014, the automotive sector significantly outperformed the overall market average for semiconductors.

CyberOptics demonstrates new WaferSense and ReticleSense Auto Multi Sensors

09/02/2015  CyberOptics Corporation, a global developer and manufacturer of high precision 3D sensing technology solutions, will demonstrate the first wireless sensor to combine leveling, vibration and Relative humidity (RH) measurement in an all-in-one device at SEMICON Taiwan in Taipei, September 2-4, 2015.

20th annual SEMICON Taiwan 2015 opens today

09/02/2015  SEMICON Taiwan 2015 opened today starting a three-day event drawing over 43,000 attendees from electronics manufacturing.

Wearables and bioelectronics seek better energy storage

09/01/2015  Energy storage players are eyeing emerging opportunities in bioelectronics as wearable, implantable and other medical devices create energy demands and design requirements beyond conventional batteries, according to Lux Research.

Tech, academic leaders call for robust research investments to bolster U.S. tech leadership, advance IoT

09/01/2015  A coalition of leaders from the tech industry and academia, led by the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), today released a report highlighting the urgent need for robust investments in research to advance the burgeoning Internet of Things (IoT) and develop other cutting-edge innovations that will sustain and strengthen America’s global technology leadership into the future.

Laith Altimime joins SEMI as President of SEMI Europe

09/01/2015  SEMI, the global association serving the electronics supply chain, today announced the appointment of Laith Altimime as president of SEMI Europe, effective October 1, 2015.

Managing dis-aggregated data for SiP yield ramp

09/01/2015  New ways are needed to feed data back and forth between designers, chip fabs, and Out-Sourced Assembly and Test (OSAT) companies.

Advances in thermo-compression bonding

09/01/2015  At the 65th IEEE ECTC, several companies presented advances in thermos-compression bonding.

IoT surveys indicate optimism, confusion

09/01/2015  Solid State Technology recently conducted a survey of our readers on how the Internet of Things (IoT) is driving the demand for semiconductor technology. A total of 303 people responded to the survey. A majority of the respondents were in management roles.

Advanced packaging and 3D-IC markets drive growth for EVG's automated 300mm polymer adhesive wafer bonding

08/31/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the company is experiencing strong demand for its automated 300mm polymer adhesive wafer bonding systems.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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