08/10/2015  Designed for use in smartphones and tablets, the backside-illuminated (BSI) chips are among the world's smallest class of CMOS image sensors, and achieve both high-performance image capture and low power consumption.

08/07/2015  ON Semiconductor Corporation today announced that Alan Campbell has joined its Board of Directors.

08/07/2015  Easily manufactured, low cost, lightweight, flexible dielectric polymers that can operate at high temperatures may be the solution to energy storage and power conversion in electric vehicles and other high temperature applications, according to a team of Penn State engineers.

08/06/2015  Toshiba Corporation today announced the development of the world’s first 16-die (max.) stacked NAND flash memory utilizing Through Silicon Via (TSV) technology.

08/06/2015  Samsung’s excellent growth rate in 2Q15 put the company closer to catching Intel and becoming the world’s leading semiconductor supplier.

08/05/2015  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced today the promotion and appointment of Dr. Han Byung Joon as Co-President and Chief Executive Officer for the Company, together with Mr. Tan Lay Koon.

08/05/2015  Intel Corporation announced it will invest $5 million over the next five years to deepen its engineering pipeline partnership with the Georgia Institute of Technology and deploy research-driven solutions to inspire and retain women and underrepresented minorities to start and complete computer science and engineering degrees.

08/04/2015  Toshiba America Electronic Components, Inc. (TAEC) today unveiled the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.

08/04/2015  Following the launch of the 12th Electronics Packaging Research Consortium (EPRC12) in 2013, A*STAR’s Institute of Microelectronics (IME) and 11 of its consortium partners across the semiconductor supply chain have developed novel solutions in integrated circuit (IC) packaging.

08/03/2015  ON Semiconductor has introduced an array of new AEC-Q100-compliant integrated circuits (ICs) optimized for implementation into next generation automobile designs.

08/03/2015  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $84.0 billion during the second quarter of 2015, an increase of 1.0 percent over the previous quarter and 2.0 percent compared to the second quarter of 2014.

07/31/2015  According to Yole, 3D TSV technology is expected to reach $4.8B billion in revenues by 2019.

07/31/2015  SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

07/30/2015  WBG companies are slowly but surely reshaping the industry and accelerate the market adoption with numerous strategic mergers and acquisitions and the development of disruptive solutions.

07/30/2015  The December 2014 edition of Process Watch suggested that the most expensive defect is the one that goes undetected until the end of line. Indeed, undetected excursions typically result in the scrap of millions of dollars per year of defective semiconductor chips.

07/29/2015  Marketshare expansion, Internet of Things opportunities, rising costs of R&D, and China’s aggressive new focus on the semiconductor industry all driving the recent M&A surge.

07/28/2015  Intel and Micron begin production on new class of non-volatile memory, creating the first new memory category in more than 25 years.

07/28/2015  The growth rate for vehicle shipments in China is slowing, but more and better performing semiconductors will still be required in automotive applications in the coming years.

07/27/2015  Within the photolithography equipment market reaching $150M in 2014, advanced packaging applications experienced the strongest growth.

07/27/2015  Qualcomm Incorporated today announced the appointment of Sunil Lalvani as vice president and president of Qualcomm India, and the departure of Avneesh Agrawal, senior vice president and president of Qualcomm India and South Asia.