07/13/2015  CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power.

07/13/2015  GLOBALFOUNDRIES today launched a new semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices.

07/13/2015  Applied Materials, Inc. today unveiled the Applied Olympia ALD system, featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

07/10/2015  Engineered SOI substrates are now a mainstream option for the semiconductor industry.

07/09/2015  Micron Technology, Inc. today announced it has appointed Trevor Schulze as Chief Information Officer (CIO).

07/09/2015  IRT Nanoelec, an R&D consortium focused on Information and Communication Technologies (ICT) using micro- and nanoelectronics, and its partners CEA-Leti, STMicroelectronics and Mentor Graphics have realized an innovative 3D chip called “3DNoC” to demonstrate the use of 3D stacking technology in scalable, complex digital systems-on-chip (SoCs).

07/09/2015  Smart devices for the Internet of Things are among the top three growth drivers for the semiconductor industry, but the IoT is a highly fragmented market where multiple applications have varying energy requirements.

07/09/2015  IBM Research today announced that working with alliance partners at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functional transistors.

07/08/2015  Updated forecast shows large-screen smartphone shipments climbing 66% this year to 252 million units while the lack of replacement purchases stymies tablets.

07/06/2015  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced worldwide sales of semiconductors reached $28.2 billion for the month of May 2015, an increase of 5.1 percent from May 2014, when sales were $26.8 billion.

07/06/2015  Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS 11 platform.

07/06/2015  Moving to the next design rule can be stressful for the inspection and metrology engineer. Like everything else in the fab, process control generally doesn’t get any easier as design rules shrink and new processes are introduced.

07/02/2015  Smartphones forecast to represent 80% of total cellphone shipments in 4Q15.

07/01/2015  ORBOTECH LTD. today announced that SPTS Technologies Group Ltd. (SPTS), an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co, Ltd.

07/01/2015  GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.

06/30/2015  The award was established to recognize new products moving the industry forward with technological developments in the microelectronics supply chain.

06/30/2015  Wisconsin researchers have developed a new biodegradable silicon transistor based on a material derived from wood, opening the door for green, flexible, low-cost portable electronics in future.

06/29/2015  In 2015,Taiwan is projected to have the highest capex for semiconductor manufacturing worldwide.

06/29/2015  When the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.

06/29/2015  Research led by Michigan State University could someday lead to the development of new and improved semiconductors.