Packaging

PACKAGING ARTICLES



TI strengthens analog marketshare; Skyworks gains from Apple's favor

05/11/2015  Top 10 suppliers accounted for 57% of analog sales in 2014; 9 of 10 top suppliers with analog sales greater than $1.0 billion.

ASE and TDK announce plans for joint venture agreement

05/08/2015  Driving towards market leadership in setting the industry standard for semiconductor miniaturization in portable and wearable consumer devices.

Microchip Technology to acquire Micrel

05/07/2015  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Micrel, Incorporated today announced that Microchip has signed a definitive agreement to acquire Micrel.

New approaches to small problems

05/07/2015  The market expectations of modern electronics technology are changing the landscape in terms of performance and, in particular, power consumption, and new innovations are putting unprecedented demands on semiconductor devices.

Visualizing formation in BEOL

05/07/2015  New tests show in real-time that cracks can run on top of and through metal layers.

Enhanced thermal management solutions for RF power amplifiers

05/06/2015  Synthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal- management technology for RF Power Amplifiers.

ITRS 2.0: Heterogeneous integration

05/06/2015  Interconnecting transistors and other components in the IC, in the package, on the printed circuit board and at the system and global network level, are where the future limitations in performance, power, latency and cost reside.

Co-design of chips, packages and boards

05/06/2015  A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools.

Silicon Storage Technology, GLOBALFOUNDRIES announce qualification of automotive grade 55nm flash memory tech

05/05/2015  Microchip Technology Inc., through its Silicon Storage Technology subsidiary, and GLOBALFOUNDRIES today announced the full qualification and availability of SST’s 55nm embedded SuperFlash non-volatile memory on GLOBALFOUNDRIES’ 55nm Low Power Extended (LPx)/ RF enabled platform.

MagnaChip announces management changes

05/04/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that Tae Young Hwang has resigned as the Company's Chief Operating Officer and President and from all other officer and director positions.

New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead

05/04/2015  A new study coauthored by Wellesley economist, Professor Daniel E. Sichel, reveals that innovation in an important technology sector is happening faster than experts had previously thought, creating a backdrop for better economic times ahead.

First quarter semiconductor sales up 6% compared to last year

05/04/2015  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $83.1 billion during the first quarter of 2015, an increase of 6.0 percent compared to the first quarter of 2014.

Intel and the Department of Science and Technology launch the "Innovate for Digital India Challenge"

05/01/2015  Intel in India reinforced its commitment to the Government of India's Digital India vision with the announcement of the Intel and DST "Innovate for Digital India Challenge", which will focus on the creation of products to increase technology adoption in India that will eventually result in the creation of a local technology ecosystem.

Entegris elects James P. Lederer to Board of Directors

05/01/2015  Entegris, Inc., a provider of yield-enhancing materials and solutions for advanced manufacturing processes, announced the election of James P. Lederer as an independent director at the Company's Annual Meeting of Shareholders held today.

SEMI releases 4th Quarter 2014 worldwide photovoltaic equipment market statistics report

04/30/2015  SEMI, the global industry association serving the manufacturing supply chain for the micro- and nano-electronics industries, this week reported that for the quarter ended December 31, 2014, worldwide photovoltaic manufacturing equipment book-to-bill ratio remained below parity, at 0.68.

SIGFOX and TI collaborate to deliver cost-effective, long-range, low-power Internet of Things connectivity

04/28/2015  SIGFOX and Texas Instruments (TI) announced the two companies are working together to increase IoT deployments using the Sub-1 GHz spectrum.

Mentor Graphics releases design solutions for the independent engineer

04/28/2015  Mentor Graphics Corporation this week announced the delivery of three new PADS family products starting at five thousand dollars to address the advancing needs of the independent engineer.

Applied Materials and Tokyo Electron terminate merger

04/27/2015  The decision came after the U.S. Department of Justice (DoJ) advised the parties that the coordinated remedy proposal submitted to all regulators would not be sufficient to replace the competition lost from the merger

Silicon Motion announces agreement to acquire Shannon Systems

04/24/2015  Silicon Motion Technology Corporation, a developer of NAND flash controllers for solid state storage devices, today announced that it has entered into a definitive agreement to acquire Shannon Systems.

Surface matters: Huge reduction of heat conduction observed in flat silicon channels

04/23/2015  A paper published in ACS Nano describes how the nanometre-scale topology and the chemical composition of the surface control the thermal conductivity of ultrathin silicon membranes.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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