04/23/2015  Automotive systems forecast to remain a major application in Europe.

04/22/2015  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

04/21/2015  Synopsys, Inc. today announced new extensions to its open-source Interconnect Technology Format (ITF) which enable modeling of complex device and interconnect parasitic effects at the advanced 10-nanometer (nm) process node.

04/21/2015  Synopsys, Inc. today announced it has signed a definitive agreement to acquire Codenomicon.

04/20/2015  Highest annual growth rate since 2010; strong growth expected again in 2015.

04/20/2015  MagnaChip Semiconductor Corporation, a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products announced today that it has kicked-off an Internet of Things (IoT) task force and will offer diversified products with ultra-low power technology in anticipation of the fast growing IoT market.

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

04/16/2015  The SIA board of directors, led by Intel CEO and SIA chairman Brian Krzanich, sent a letter today to congressional leaders expressing support for the legislation and urging its swift passage.

04/16/2015  Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.

04/16/2015  The recently released Samsung Galaxy S6 Edge is the most expensive Galaxy S line smartphone yet built, but has a lower retail price than a comparable iPhone 6 Plus, according to a preliminary estimate by IHS and its Technology Mobile Handsets Intelligence Service.

04/15/2015  A*STAR’s Institute of Microelectronics (IME), together with industry partners, have formed a High-Density Fan-Out Wafer Level Packaging (FOWLP) consortium to extend FOWLP capabilities for applications in devices such as smart phones, tablets, navigation tools and gaming consoles.

04/14/2015  Semiconductor equipment manufacturer ClassOne Technology announced today that it has signed a joint electrochemical deposition (ECD) applications lab agreement with Shanghai Sinyang Semiconductor Materials Co., Ltd.

04/14/2015  April 2015 marks the 50th anniversary of one of the business world?'s most profound drivers, now commonly referred to as Moore's Law.

04/14/2015  On June 18, the SEMI Packaging Tech Seminar will take place in Vila do Conde, Portugal.

04/14/2015  Duke University researchers are working to advance the tools and methodologies used to test 3D integrated circuits (ICs), which promise to help ensure the ongoing development of higher performance, lower power semiconductor chips.

04/10/2015  Integrated Device Technology, Inc. today announced that Robert A. Rango, a former Broadcom Corp. executive with extensive leadership skills in the global semiconductor market, has been appointed to IDT’s Board of Directors, effective April 6, 2015.

04/09/2015  2014 was the second record breaking year in a row in terms of semiconductor device revenues; the industry grew a robust 10 percent to total $336 billion, according to the WSTS.

04/07/2015  STATS ChipPAC Ltd. announced that Cavendish Kinetics, a provider of high performance RF MEMS tuning solutions for LTE smartphones and wearable devices, has adopted its advanced wafer level packaging technology

04/07/2015  When the commercial semiconductor manufacturing industry decides to move to the next wafer size of 450mm, it will be time to re-consider equipment and facilities strategies.

04/07/2015  The global semiconductor materials market increased 3 percent in 2014 compared to 2013 while worldwide semiconductor revenues increased 10 percent.