03/03/2015  Embedded die in substrate: what are the next steps for the growth?

03/03/2015  Yole Développement (Yole) announces the return to the power electronics market growth, after two years of stagnancy.

03/03/2015  Chipmaker NXP Semiconductors NV announced Sunday night that it has agreed to buy Freescale Semiconductor Ltd for $11.8 billion and merge business operations.

03/02/2015  SEMICON Russia, a meeting place of the entire micro- and nanoelectronics industry in Russia, will take place from 16 to 18 June in Moscow.

02/26/2015  This week, at the 2015 International Solid State Circuits Conference (ISSCC), imec, in collaboration with Tyndall National Institute, the University of Leuven (KULeuven) and the Ghent University, demonstrated a 4x20Gb/s wavelength division multiplexing (WDM) hybrid CMOS silicon photonics transceive

02/26/2015  Updated forecast expects robust 8.2% average annual unit shipment growth through 2019.

02/25/2015  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2015) will be held May 3-6 in Saratoga Springs, New York.

02/25/2015  Today, at the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79GHz.

02/25/2015  The inaugural SEMICON Southeast Asia, will run from 22–24 April at the Subterranean Penang International Convention and Exhibition Centre (SPICE) in Penang, Malaysia.

02/24/2015  “Fan-Out Wafer Level Packaging (FOWLP) is already in high-volume” announces Yole Développement (Yole) in its new report, Fan-Out and Embedded Die: Technologies & Market. According to Yole’s analysts, FOWLP market reaches almost $200M in 2015.

02/24/2015  AG Semiconductor Services, LLC (AGSS), one of the largest suppliers of used electronics manufacturing equipment, is pleased to announce that it has entered into a strategic relationship with JA Mitsui Leasing, Ltd. (JAML).

02/23/2015  At the SPIE Advanced Lithography conference in San Jose, Calif., Applied Materials, Inc., today announced the industry's first in-line 3D CD SEM metrology tool for solving the challenges of measuring the high aspect ratio and complex features of 3D NAND and FinFET devices.

02/20/2015  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

02/20/2015  3DICs are assumed to suffer from stronger thermal issues when compared to equivalent implementations in traditional single-die integration technologies.

02/20/2015  Pulsed measurements are defined in Part 1, and common pulsed measurement challenges are discussed in Part 2.

02/20/2015  University of Pennsylvania researchers have made an advance in manufacturing one such material, molybdenum disulphide.

02/19/2015  Micron Technology, Inc. today announced that Robert Peglar has been named as vice president of Advanced Storage Solutions.

02/19/2015  Mentor Graphics Corporation today announced the call-for-entries for its first annual Don Miller Award for Excellence in System Level Thermo-Fluid Design.

02/19/2015  SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2015 which takes place October 6-8 in Dresden, Germany. Technical presentation abstracts are due April 30.

02/19/2015  China's new industry investment and government promotion policies outlined in the recent "National Guidelines for Development and Promotion of the IC Industry" represents major opportunities for China and global semiconductor companies.