Packaging

PACKAGING ARTICLES



Gov. Baker announces $4M grant to UMass Lowell to fuel emerging printed electronics cluster

01/29/2015  Gov. Charlie Baker today announced a $4 million dollar grant from the Massachusetts Technology Collaborative (“MassTech”) to UMass Lowell to support development of a printed and flexible electronics industry cluster, an emerging field that has the potential to become a $76 billion global market in the next decade.

New MES operations improvement software from critical manufacturing features integrated scheduling

01/28/2015  Critical Manufacturing, a supplier of integrated manufacturing execution systems (MES), introduces cmNavigo 4.0, the industry’s first comprehensive MES software with embedded finite scheduling.

2014 was bumper year for automotive semiconductors

01/27/2015  The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

01/26/2015  Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

Emerging non volatile memory technological choices are about to be made: STTMRAM or MRAM?

01/26/2015  “The technological choice between STTMRAM/MRAM and RRAM will be made in the next two years,” announces the “More Than Moore” market research, technology and strategy consulting company, Yole Développement (Yole).

North American semiconductor equipment industry posts December 2014 book-to-bill ratio of 0.98

01/26/2015  North America-based manufacturers of semiconductor equipment posted $1.37 billion in orders worldwide in December 2014 (three-month average basis) and a book-to-bill ratio of 0.98, according to the December EMDS Book-to-Bill Report published today by SEMI.

EMCORE Corporation announces the appointment of Dr. Hank Blauvelt as Chief Technology Officer

01/23/2015  EMCORE Corporation, a provider of compound semiconductor-based components, subsystems and systems for the broadband and specialty fiber optics market, announced today the appointment of Dr. Hank Blauvelt to Chief Technology Officer for EMCORE Corporation, reporting to Chief Executive Officer, Jeffrey Rittichier.

Graphene enables all-electrical control of energy flow from light emitters

01/23/2015  Scientists from ICFO, MIT, CNRS, CNISM and Graphenea have now demonstrated active, in-situ electrical control of the energy flow from erbium ions into photons and plasmons.

Will new policy in China trigger big changes?

01/21/2015  In June 2014, the State Council of China issued the "National Guideline for the Development and Promotion of the IC Industry,” to support the domestic semiconductor industry. The document addresses development targets, approaches, and measures.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Underdog DRAM

01/20/2015  DRAM shifts out of a slump, but sector still faces obstacles.

Samsung Electronics starts mass producing industry’s first 8-gigabit graphics DRAM

01/15/2015  Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 8 gigabit (Gb) GDDR5 DRAM, based on the company’s leading-edge 20-nanometer (nm) process technology.

Amkor Technology announces settlement with Tessera

01/15/2015  Amkor Technology, Inc. today announced the settlement of its outstanding litigation and arbitration proceedings with Tessera, Inc.

UC Berkeley Extension launches three online programs in semiconductor technology

01/15/2015  UC Berkeley Extension announces three online integrated circuit (IC) semiconductor technology programs to meet the training needs of the surging worldwide semiconductor industry; the industry is predicted to reach $345 billion in sales this year.

Orbotech announces collaboration between SPTS and Fraunhofer on process development of wafer level packaging

01/15/2015  Orbotech Ltd. today announced that SPTS Technologies is collaborating with Fraunhofer IZM, an international institute specializing in applied and industrial contract research, on next generation wafer level packaging of microelectronic devices.

Further growth seen for semiconductor equipment and materials at SEMI ISS 2015

01/14/2015  The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme “Riding the Wave of Silicon Magic.”

JEOL and UC Irvine partner to develop electron microscopy and materials research center

01/14/2015  JEOL USA and the University of California's Irvine Materials Research Institute (IMRI) have entered into a strategic partnership to create a premier electron microscopy and materials science research facility.

SUNY Board appoints Dr. Alain Kaloyeros as founding president of SUNY Polytechnic Institute

01/14/2015  SUNY Polytechnic Institute (SUNY Poly) yesterday announced the SUNY Board of Trustees has appointed Dr. Alain Kaloyeros as the founding President of SUNY Poly.

Zinc oxide materials tapped for tiny energy harvesting devices

01/13/2015  New research helps pave the way toward highly energy-efficient zinc oxide-based micro energy harvesting devices with applications in portable communications, healthcare and environmental monitoring, and more.

Mentor Graphics acquires Flexras Technologies

01/13/2015  The Flexras timing-driven partitioning technology will expand and strengthen the portfolio of tools available from Mentor to help engineers overcome the challenges of increasingly complex design prototyping.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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