Packaging

PACKAGING ARTICLES



Industry overshooting capital spending needs for NAND flash memory

07/11/2018  Overspending by the major NAND suppliers expected to further cool NAND flash prices this year.

FET fabrication from fins to nano-sheets

07/11/2018  As the commercial IC fabrication industry continues to shrink field-effect transistor (FET) sizes, 2D planar structures evolved into 3D fins which are now evolving into 3D stacks of 2D nano-sheets.

Intel wins SEMI Award at SEMICON West for process and integration

07/11/2018  Intel has won SEMI's 2018 Award for the Americas. SEMI honored the celebrated chipmaker for pioneering process and integration breakthroughs that enabled the first high-volume Integrated Silicon Photonics Transceiver. The award was presented yesterday at SEMICON West 2018.

The outlook for new metrology approaches

07/10/2018  To keep up with Moore's Law, the semiconductor industry continues to push the envelope in developing new device architectures containing novel materials.

The cobbler's children getting shoes?

07/10/2018  There's an old proverb that the shoemaker's children always go barefoot, indicating how some professionals don't apply their skills for themselves. Until lately, that has seemed the case with the semiconductor manufacturing industry which has been good at collecting massive amounts of data, but no so good at analyzing that data and using it to improve efficiency, boost yield and reduce costs.

High gas flow rates create pumping challenge

07/10/2018  Increasingly complicated 3D structures such finFETs and 3D NAND require very high aspect ratio etches. This, in turn, calls for higher gas flow rates to improve selectivity and profile control. Higher gas flow rates also mean higher etch rates, which help throughput, and  higher rates of removal for etch byproducts.

Material innovations for advancements in fan-out packaging

07/09/2018  The development of a new class of materials with superior functionalities is essential to enable emerging process schemes for wafer- or panel-level FO packaging.

Optimized stepping for fan-out wafer and panel packaging

07/09/2018  Optimized stepping, based on parallel analysis of die placement errors and prediction of overlay errors, can increase lithography throughput by more than an order of magnitude and deliver commensurate reductions in cost of ownership. The productivity benefits of optimized stepping are demonstrated using a test reticle with known die placement errors.

Big changes at the top and bottom of Q1 semiconductor equipment market shares

07/09/2018  Market shares of semiconductor equipment manufacturers shifted significantly in Q1 2018 as Applied Materials, the top supplier dropped, according to the report “Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts,” recently published by The Information Network.

Imec demonstrates hybrid finFET-silicon photonics technology for ultra-low power optical I/O

07/09/2018  Today at its Imec Technology Forum USA in San Francisco, imec, the research and innovation hub in nano-electronics and digital technology, announced that it has demonstrated ultra-low power, high-bandwidth optical transceivers through hybrid integration of Silicon Photonics and FinFET CMOS technologies.

SEMICON West 2018 highlights smart technologies, workforce development, industry growth

07/09/2018  Smart technologies take center stage tomorrow as SEMICON West, the flagship U.S. event for connecting the electronics manufacturing supply chain, opens for three days of insights into leading technologies and applications that will power future industry expansion.

$62.7B semiconductor equipment forecast: Top previous record, Korea at top but China closes the gap

07/09/2018  Releasing its Mid-Year Forecast at the annual SEMICON West exposition, SEMI, the global industry association representing the electronics manufacturing supply chain, today reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 10.8 percent to $62.7 billion in 2018, exceeding the historic high of $56.6 billion set last year.

Merging antenna and electronics boosts energy and spectrum efficiency

07/05/2018  Research could lead to longer talk time and higher data rates in 5G devices.

Automotive is driving SiC adoption

07/05/2018  The SiC power market is now on the road, asserts Yole Développement (Yole). Therefore, since 2017, the market research and strategy consulting company identified more than 20 strategic announcements, showing the dynamism of this market and attractiveness of the technology.

ROHM's new CMOS op-amp delivers leading-class low noise

07/05/2018  Ideal for industrial applications that demand high-accuracy sensing, including sonar and optical sensors.

EV Group accelerates 3D-IC packaging roadmap with breakthrough wafer bonding technology

07/03/2018  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView NT3 aligner.

Alta Devices breaks solar energy efficiency record

07/02/2018  Alta Devices has today announced that its most recent single junction solar cell has been certified by NREL (National Renewable Energy Laboratory) as being 28.9% efficient.

New infrastructure and sensors extract actionable information from mature IoT

07/02/2018  For medtech applications to flourish, sensors need a supporting infrastructure that translates the data they harvest into actionable insights, says Qualcomm Life director of business development Gene Dantsker, who will speak about the future of digital healthcare in the Medtech program at SEMICON West.

SEMI Americas and Solid State Technology announce 2018 "Best of West" award finalists

06/27/2018  Selected from over 600 exhibitors, SEMI announced today that the following Best of West 2018 Finalists will be displaying their products on the show floor at Moscone Center from July 10-12.

TowerJazz announces 2018 annual Technical Global Symposium events

06/26/2018  TowerJazz, the global specialty foundry, today announced details on its 13th annual Technical Global Symposium (TGS) being held in China, Japan, and the United States.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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