06/19/2014  Design and construction professionals are showing unprecedented levels of collaboration through the G450C.

06/19/2014  GS Nanotech, microelectronics products development and manufacture center, plans to launch mass assembly of 3D stacked TSV (through-silicon via) microcircuits in next few years.

06/19/2014  Entegris Inc., a Billerica-based materials and solutions provider to the microelectronics industries, today inaugurated its new i2M Center for Advanced Materials Science ("The i2M Center") in Bedford, Massachusetts.

06/18/2014  SHINES will investigate several aspects of basic research: new ultrathin films, nanostructured composites, high resolution imaging, the transport of electrical signals, heat and light.

06/18/2014  Bookings recover for second consecutive quarter; above parity for first time since 2011

06/17/2014  Boston Semi Equipment LLC (BSE) today announced it has completed the acquisition of MVTS Technologies (MVTS).

06/17/2014  Cadence Design Systems, Inc. today announced that it has completed the acquisition of Jasper Design Automation, Inc.

06/16/2014  In 2004/2005, shipments of 300mm wafer fab equipment (WFE) began to outpace that of 200mm platforms.

06/12/2014  The introduction of new materials, such as III-Vs, into high-volume manufacturing of semiconductors, likely will occur sometime around the 7nm and/or 5nm nodes.

06/11/2014  ANSYS, Inc., and Intel Corporation announced the availability of a production-proven reference flow for power, EM and reliability sign-off using ANSYS simulation solutions for Intel's 14nm Tri-Gate process, showcasing it at last week's Design Automation Conference.

06/09/2014  ON Semiconductor today signed a definitive agreement to acquire Aptina Imaging, a provider of high-performance CMOS image sensors for automotive and industrial markets.

06/09/2014  According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

06/06/2014  TowerJazz, a global specialty foundry, and Genoray Co. Ltd., a manufacturer of digital X-ray devices, today announced collaboration on the successful development of a CMOS image sensor (CIS) for medical diagnostic devices such as X-ray equipment, fluoroscopy and radiography.

06/05/2014  The 2014 Electronic Component Technology Conference (ECTC) took place last week in Orlando Florida.

06/05/2014  The Semiconductor Industry Association (SIA) yesterday announced that worldwide sales of semiconductors reached $26.34 billion for the month of April 2014.

06/05/2014  As smart materials become one of the fastest growing areas of materials technology, SABIC and Cima NanoTech, a Singapore and US-based company, have announced the joint development of a plastics industry first: a transparent conductive polycarbonate film that has the potential to revolutionize the materials used in consumer electronics, household goods, automotive, architecture and healthcare.

06/04/2014  Scaleo chip, the fabless semiconductor company in automotive electronics for powertrain, body control and driver-information, has used the GLOBALFOUNDRIES 55nm eFlash NVM Platform to develop a new family of microcontrollers.

06/04/2014  Synopsys, Inc. today announced it has extended its collaboration with STMicroelectronics to include Samsung Electronics, enabling broader market adoption of ST's 28nm FD-SOI technology for SoC design.

06/04/2014  After two years of decline, fab equipment spending is expected to increase 24 percent in 2014 and about 11 percent (US$39.5 billion).

06/03/2014  Synopsys, Inc. and Intel Corporation today announced broad SoC design enablement for Intel's 14nm Tri-Gate process technology for use by customers of Intel Custom Foundry.