Packaging

PACKAGING ARTICLES



Osamu Nakamura named President of SEMI Japan

06/03/2014  Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Samsung's 14nm finFET process technology ecosystem solidly in place for mobile consumer and SoC applications

06/02/2014  Samsung today announced that the IP and design enablement ecosystem for its foundry’s 14nm FinFET process technology is firmly in place as customers begin their early design work.

Critical test issues up for debate at Test Vision 2020

06/02/2014  Test professionals who want to learn, forecast and debate the future of semiconductor test will attend the 7th annual IEEE Test Vision 2020 Workshop, held in conjunction with SEMICON West 2014 (July 8-10) in San Francisco.

Global semiconductor leaders develop plan to promote worldwide industry growth

05/28/2014  The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.

Applied Materials enables cost-effective vertical integration of 3D chips

05/28/2014  Applied Materials, Inc. today introduced the Endura Ventura PVD system that helps customers reduce the cost of fabricating smaller, lower power, high-performance integrated 3D chips.

Amkor and Carsem announce patent infringement settlement

05/28/2014  Amkor Technology, Inc. and Carsem today jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor's MicroLeadFrame (MLF) patents.

STATS ChipPAC introduces robust encapsulated wafer level packaging technology

05/28/2014  STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, today introduced encapsulated Wafer Level Chip Scale Package, a packaging technology that raises the industry standard of durability for Wafer Level Chip Scale Packaging (WLCSP).

Synopsys and TSMC collaborate to validate DesignWare IP in TSMC 16nm FinFET process

05/27/2014  Synopsys, Inc. today announced the validation of DesignWare IP in the TSMC 16nm FinFET process technology, demonstrating the ongoing collaboration between Synopsys and TSMC to provide designers with proven IP for their advanced system-on-chip (SoC) designs.

Ziptronix and EV Group demonstrate submicron accuracies for wafer-to-wafer hybrid bonding

05/27/2014  ­ Ziptronix Inc. and EV Group today announced they have successfully achieved submicron post-bond alignment accuracy on customer-provided 300mm DRAM wafers.

KLA-Tencor announces new Teron SL650 reticle inspection system

05/23/2014  Today, KLA-Tencor Corporation announced the Teron SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

Microchip Technology to acquire ISSC Technologies

05/22/2014  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and ISSC Technologies Corporation (ISSC) today announced that Microchip has signed a definitive agreement to acquire ISSC.

SPTS Technologies announces the Omega Rapier XE System for 300mm wafer silicon etch processing

05/22/2014  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etching.

DAC panels tackle giga-scale design challenges, semiconductor market in China

05/21/2014  The ProPlus blog here on Solid State Technology has looked at giga-scale design challenges and, this year, so will the Design Automation Conference (DAC).

Mentor Graphics acquires Nimbic

05/20/2014  Mentor Graphics Corp. today announced that it has acquired Nimbic, Inc., a provider of Maxwell-accurate, 3D full-wave electromagnetic (EM) simulation solutions.

ON Semiconductor introduces new family of low voltage power MOSFETs

05/20/2014  ON Semiconductor has introduced a new family of six N-channel MOSFETS that have been designed and optimized to deliver efficiency.

Slideshow: What to look for at IITC 2014

05/20/2014  The 17th annual IITC will be held May 21 – 23, 2014 in conjunction with the 31st AMC at the Doubletree Hotel in San Jose, California.

MediaTek, SK Hynix, AMD, and Micron sales surge in first quarter

05/19/2014  Top 20 ranking shows that semiconductor industry company consolidation continues to accelerate.

SMIC and other groups collaborate to setup the "IC Advanced Technology Research Institute"

05/19/2014  China's, largest and most advanced semiconductor foundry, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.

Brewer Science unveils Apogee temporary wafer bonder

05/19/2014  Brewer Science, Inc., a supplier of thin-wafer handling technology, materials, and equipment to the microelectronics industry, today unveiled the Brewer Science Apogee bonder for temporary wafer bonding applications.

Domestic outsourcing: A key component in successful reshoring

05/16/2014  After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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