05/16/2014  One way to make Li-ion batteries more durable, safer, smaller and in particularly faster, is a transition towards all solid-state 3D thin-film Li-ion batteries.

05/16/2014  Although on-chip interconnects have not been scaling at the same speed as other parts of the chip, new capabilities enabled by graphene and CNTs, among other materials, could soon change that.

05/15/2014  There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

05/15/2014  Embedded memory is now consuming most of the area on an SoC chip. Complexity and circuit size are only growing, which means smaller process geometries, larger designs, and tighter design margins.

05/14/2014  A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

05/13/2014  Mentor Graphics Corporation today announced the new MicReD Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance.

05/13/2014  Applied Materials, Inc. today announced its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.

05/09/2014  Environmentally friendly solar cell pushes forward the "next big thing in photovoltaics."

05/08/2014  Given the slow economic growth in the U.S. during the first quarter, coupled with challenging geo-political developments around the world,uncertainty once again permeates the industry outlook for the year.

05/08/2014  BASF today inaugurated a new Electronic Materials Sampling and Development facility in Hillsboro, Oregon. The new facility is a strategic step towards establishing a North American footprint to supply materials for semiconductor manufacturing applications related to the electronics industry.

05/07/2014  University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC) are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.

05/07/2014  GLOBALFOUNDRIES today introduced an optimized semiconductor manufacturing platform aimed specifically at meeting the stringent and evolving needs of the automotive industry.

05/06/2014  Avago Technologies Limited and LSI Corporation today announced Avago has completed its acquisition of LSI Corporation for $11.15 per share in an all-cash transaction valued at approximately $6.6 billion.

05/06/2014  Microchip Technology Inc., a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today introduced a new parallel Flash memory device.

05/06/2014  With partner GLOBALFOUNDRIES, the company also announces the completion of product and process qualification for the advanced RF SOI technology.

05/06/2014  Intel Corporation and other companies today introduced a new lineup of Chrome devices, including the first designs using Intel Celeron processors based on the Bay Trail-M system-on-chip (SoC).

05/05/2014  Intel Corporation today announced it has named Steven Fund, a senior industry executive with extensive brand and marketing experience, to the post of corporate vice president and Chief Marketing Officer reporting directly to Intel CEO Brian Krzanich.

05/05/2014  Qualcomm today announced the election of Harish Manwani to its Board of Directors. Manwani brings more than 35 years of consumer product and global management experience, and currently serves as the Chief Operating Officer at Unilever PLC.

04/30/2014  Ziptronix Inc., a provider of patented, low-temperature direct bonding technology for 3D integration, today announced a limited exclusive patent licensing agreement with IO Semiconductor (IOsemi) for application of its ZiBond technology for use in RF front-end devices for consumer mobile products.

04/30/2014  Zeta Instruments, Inc., an optical profiling and inspection company providing solutions for high-tech manufacturing, has announced that Jeff Donnelly has joined the company as its chief operating officer.