04/30/2014  Entegris, Inc. today announced that it has completed its acquisition of ATMI, Inc., creating a supplier of products and materials for semiconductor and other advanced manufacturing.

04/29/2014  Micron Technology, Inc. this week announced a new enterprise-class solid state drive (SSD) designed specifically for data center storage platforms.

04/29/2014  There is no disputing graphene is strong. But new research by Rice University and the Georgia Institute of Technology should prompt manufacturers to look a little deeper as they consider the miracle material for applications.

04/29/2014  In a first-of-its-kind study of how a material some think could transform the electronics industry moves in water, researchers at the University of California, Riverside Bourns College of Engineering found graphene oxide nanoparticles are very mobile in lakes or streams and therefore likely to cause negative environmental impacts if released.

04/28/2014  Previous semiconductor technology generations developed more clearly defined “winners” in terms of process technologies and materials choices.

04/28/2014  M/A-COM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced a new GaN on SiC HEMT Pulsed Power Transistor for civilian and military radar pulsed applications.

04/25/2014  Recognizing the changing dynamics of the microelectronics industry in Southeast Asia, SEMI today announced the expanded scope of its industry-leading SEMICON regional exposition which will now rotate between Singapore and other locations within Southeast Asia.

04/24/2014  Spansion is adding three new Serial NOR and three new NAND memory densities specifically qualified to meet the extended temperature ranges and stringent quality requirements of the automotive industry.

04/22/2014  Contour Semiconductor, Inc., a provider dedicated to producing low-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer.

04/22/2014  Tessera Technologies, Inc. announced today that Invensas Corporation and South Korea-based STS Semiconductor & Telecommunications, a semiconductor assembly and test solution provider, have entered into an agreement to validate high volume manufacturing capability for Invensas' Bond Via Array (BVATM) technology for next generation smartphone and tablet customers.

04/22/2014  The new program addressing the most important and critical issues facing the future of semiconductor manufacturing in a new and more technical conference format.

04/21/2014  Cadence Design Systems, Inc. today announced plans to acquire Jasper Design Automation, Inc., a provider of formal analysis solutions, for approximately $170 million in cash.

04/21/2014  Altera Corporation and TSMC today announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs.

04/18/2014  Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

04/18/2014  Permanent bonding technology is a key process for a wide range of applications in the semiconductor industry such as MEMS, advanced packaging, LED devices, and SOI substrate applications.

04/17/2014  Fabless companies could skip the 20nm node and move straight to 14nm FinFETs. That is the hope of GLOBALFOUNDRIES and Samsung who are announcing a joint program that offers a single process design kit (PDK) and manufacturing at four different fabs with identical processes.

04/16/2014  Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced that it has shipped its 100-millionth component.

04/16/2014  Scientists from Dynaloy, LLC and EV Group will explain a new, one-step cleaning process for removing negative dry film and negative spin-on film photoresist on April 24, 2014 at the SEMATECH Surface Preparation and Cleaning Conference in Austin, Texas.

04/15/2014  Mentor Graphics Corp. today announced that its IC design to silicon solution has achieved certification for TSMC's Design Rule Manual (DRM) and SPICE model version 1.0 for its 16nm FinFET process.

04/14/2014  SEMI reports that the worldwide semiconductor photomask market was $3.1 billion in 2013 and is forecasted to reach $3.3 billion in 2015.