03/05/2014  Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market.

03/05/2014  While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

02/28/2014  We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions.

02/28/2014  In launching the iPod music player, Apple bumped consumption of NAND flash – a type of non-volatile storage device – driving down cost and paving the way for the growth of the memory technology into what is now a multibillion dollar market, supplying cost-effective storage for smart phones, tablets and other consumer electronic gadgets that do not have high density requirements.

02/26/2014  GLOBALFOUNDRIES and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GLOBALFOUNDRIES will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

02/24/2014  SEMI announced the “Call for Papers” for technical sessions and presentations for SEMICON Europa 2014 which takes place October 7-9 in Grenoble, France.

02/24/2014  International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

02/21/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

02/21/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, and Jiangsu Changjiang Electronics Technology Co., Ltd., the largest packaging service provider in China, jointly announced today a joint venture for 12" bumping and related testing.

02/21/2014  Samsung Electronics Co., Ltd., and the University of California, San Francisco (UCSF) announced a partnership to accelerate validation and commercialization of promising new sensors, algorithms, and digital health technologies for preventive health solutions.

02/20/2014  Epoxy Technology, Inc. and John P. Kummer Group announce the formation of a new specialty adhesive packaging company, Epoxy Technology Europe Ltd (ETEL).

02/20/2014  The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

02/20/2014  In another example of the old one-liner that “all that is old is new again,” the old technique of solid-source doping is being used by Intel for a critical process step in so-called “14nm node” finFET manufacturing.

02/20/2014  Embedded SRAM scaling is broken and, with it, Moore's Law.

02/18/2014  Imec, in collaboration with Vrije Universiteit Brussel, Brussels, Belgium, presents the world’s first 79 GHz radar transmitter implemented in plain digital 28nm CMOS.

02/18/2014  Dr. Tae-Wook Kim at KIST announced their successful development of a 64-bit memory array using flexible and twistable carbon nano material and organo-polymer compound, which can accurately store and delete data.

02/18/2014  Renesas Electronics Corporation today announced that it has developed the industry's first 28nm flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28nm process technology.

02/14/2014  Honeywell announced today that it has introduced new RadLo low alpha plating anodes based on proprietary technology to help reduce alpha particle radiation that can lead to data errors in semiconductors.

02/13/2014  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

02/11/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.