06/25/2018  Micron Technology, Inc. today announced volume production on its 8Gb GDDR6 memory.

06/22/2018  The global organic CMOS image sensor market is expected to value at $696.0 million in 2020, and is projected to reach $1,750.0 million by 2025, registering a CAGR of 20.9% from 2021 to 2025.

06/22/2018  China accounted for 7 of top 10 leading smartphone suppliers in 2017, share grows to 42%.

06/21/2018  The semiconductor industry posted record results in 2017, with revenue exceeding US$400 billion.

06/20/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology, will present a process flow for a complementary FET (CFET) device for nodes beyond N3.

06/19/2018  At this week’s 2018 Symposia on VLSI Technology and Circuits, imec, the research and innovation hub in nanoelectronics and digital technology presented considerable progress in enabling germanium nanowire pFET devices as a practical solution to extend scaling beyond the 5nm node.

06/15/2018  Marshall (Mac) Blythe has joined Micross in the role of General Manager of Component Modification Services (CMS) located in Hatfield, PA.

06/15/2018  FormFactor, Inc., a electrical test and measurement supplier to the semiconductor industry, has extended its Contact Intelligence technology.

06/14/2018  pSemi Corporation (formerly known as Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces the availability of the PE29101 gallium nitride (GaN) field-effect transistor (FET) driver for solid-state light detection and ranging (LiDAR) systems.

06/14/2018  Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies—including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless—will account for 55 percent of connectivity integrated circuit (IC) shipments in 2018, according to a new report from business information provider IHS Markit

06/13/2018  Plasma-Therm, the manufacturer of plasma etch, deposition, and advanced packaging equipment for the production of specialty semiconductor devices, announced today the successful acquisition of CORIAL, a France-based plasma processing equipment supplier.

06/08/2018  Winbond’s new high-performance Serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s.

06/06/2018  Industry forecast projects sales will increase 12.4 percent in 2018 and 4.4 percent in 2019.

06/06/2018  Breakthrough could pave the way for smaller transistors.

06/06/2018  ROHM and GaN Systems announced their collaboration in the GaN (gallium nitride) Power Semiconductor business, with the goal of contributing to the continuing evolution of power electronics.

06/05/2018  New RF power transistors simplify design and manufacturing.

06/05/2018  IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (EPS) today announced Dr. William Chen as the recipient of the 2018 IEEE Electronics Packaging Award.

06/04/2018  Dow Performance Silicones further enhanced design flexibilities and processing options for consumer device and display OEMs today with the addition of DOWSIL™ SE 9100 and DOWSIL™ SE 9160 Adhesives to its portfolio of one-part, room-temperature cure (RTV) silicone solutions.

06/01/2018  Synopsys, Inc. today announced that it has collaborated with Toshiba Memory Corporation to accelerate the verification of Toshiba Memory Corporation's BiCS FLASH vertically stacked three-dimensional (3D) flash memory.

06/01/2018  18.5% forecast increase in 2018 driven by systems monitoring and control, safety, ADAS, convenience, and growth of autonomous driving. Continued rise of memory ASP adds to growth.