11/21/2013  Foundry 2.0 partnership with Open-Silicon and Amkor Technology yields successful 2.5D test vehicle project.

11/20/2013  SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

11/20/2013  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

11/19/2013  The DesignForward award supports the research of the interconnect architectures and technologies needed to support the data transfer capabilities in extreme-scale computing environments.

11/18/2013  STMicroelectronics and Yogitech, a provider of functional safety solutions, have signed an agreement to create a comprehensive package that will simplify the development and certification of safety-critical applications based on STM32 microcontrollers.

11/18/2013  Designed for stringent industrial requirements, Spansion FM Family offers a range of high performance and low power solutions.

11/14/2013  SEMI announced today that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28.

11/12/2013  FlipChip International announced today the 100% acquisition of Millennium Microtech (Shanghai) - (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China.

11/11/2013  The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

11/11/2013  Xilinx today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device.

11/11/2013  Toshiba Corporation today announced that started sample shipments of a VGA, 1/4 inch CMOS image sensor, “TCM5126GBA,” for automotive view cameras.

11/07/2013  Efforts make embedded memory faster, cooler and simpler.

11/07/2013  SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

11/07/2013  Development of voltage-tunable radio frequency inductors boosts semiconductor and defense industry applications.

11/07/2013  Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.

11/05/2013  Clearly Moore's law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays - transistors) to achieve minimum cost will double every year.

11/01/2013  Columbia Engineers develop new device architecture for 2D materials, making electrical contact from the 1D edge.

11/01/2013  SMT equipment market continues to derive demand from major downstream industry segments including telecommunications, computing and consumer appliances, which are the most prolific users of PCBs, according to a new report from Global Industry Analysts, Inc.

10/31/2013  Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

10/30/2013  At the recent ECTC conference, various presentations addressed silicon interposers for 2.5D (Shinko), CoWoS reliability (TSMC) and microbumping (imec).