10/30/2013  Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.

10/30/2013  3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.

10/30/2013  The choice between buying new systems from OEMs or fully capable refurbished gear from qualified used equipment vendors is examined.

10/30/2013  Some unexpected underdogs spur spending spree.

10/29/2013  Start-up Triton Microtechnologies, a designer and manufacturer of ultra-thin glass interposers that enable advanced semiconductor-packaging solutions, has met six-month production milestones that have triggered an additional $3.2 million in funding.

10/28/2013  Dr. Ramesh Ramadoss, Senior Manager in the MicroProbe Product Group of FormFactor Inc., provides an overview of MEMS and highlights a variety of applications in the biomedical area, including pressure sensors, inertial sensors, transducers for hearing aids, microfluidics for diagnostics and drug delivery, micromachined needles and microsurgical tools.

10/24/2013  Micron Technology, Inc. today announced that the company has named Brian Angell, vice president, Advanced Controller Development.

10/23/2013  While the number of materials used in semiconductor logic will increase approximately 50 percent in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced, challenging developers, manufacturers, equipment, and materials suppliers, according to experts speaking at the SEMI Strategic Materials Conference 2013, held in Santa Clara on October 16-17.

10/23/2013  CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

10/23/2013  Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

10/21/2013  In the 1960s, James Early of Bell Labs proposed three-dimensional structures as a natural evolution for integrated circuits. Since then many attempts have been made to develop such a technology.

10/21/2013  Alpha and Omega Semiconductor Limited this week released a new dual MOSFET family in the common-drain configuration in both DFN 5x6 and Micro-DFN 3.2x2 packages.

10/18/2013  Total shipments of analog devices forecast to jump 14% in 2013.

10/16/2013  Nanoelectronics research center imec and Excico have successfully demonstrated the application of laser thermal anneal (LTA) to boost the current in vertical polysilicon channel devices for 3D memory.

10/15/2013  Small form factor, high speed and performance, and high bandwidth capability with low battery consumption are desired traits for many packaging solutions for integrated circuits (ICs).

10/15/2013  At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

10/15/2013  A research team in Japan has built a triangular InGaAs-on-insulator n-MOSFETs using MOVPE that has a high on-current of 930 µA/µm.

10/14/2013  Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.

10/10/2013  SEMI believes that the semiconductor materials market will trend with the device market, resulting in an increase of one percent this year and a seven percent increase in 2014, resulting in a materials market approaching $50 billion in 2014.

10/09/2013  Next-gen SnAg offers industry-leading plating rates and process flexibility for flipchip packages and interconnects