10/09/2013  For the first time, researchers have mapped this EUV emission and developed a theoretical model that explains how the emission depends on the three-dimensional shape of the plasma.

10/09/2013  Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

10/09/2013  Silicon Labs, a developer of high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s most energy-friendly 32-bit microcontrollers (MCUs) based on the ARM Cortex-M0+ processor.

10/08/2013  Micron Technology, Inc. today announced that the company has named Tom Snodgrass, vice president, System Solutions.

10/04/2013  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

10/04/2013  The Internet of Things represents a new construct in the information and communications technology world that is occupying the minds of IT vendors, service providers, and systems integrators as it represents huge potential for new streams of revenue and new customers.

10/04/2013  Researchers from Taiwan’s National Nano Device Laboratories avoided the use of TSVs by fabricating a monolithic sub-50nm 3D using a novel CMP technique.

10/04/2013  Intermolecular, Inc. and RUSNANO, the Fund for Infrastructure and Educational Programs, today announced the signing of a joint development agreement between Intermolecular and Ulnanotech, the leading Russian Federation nanocenter based in Ulyanovsk.

10/02/2013  Ultra low power (ULP) RF specialist Nordic Semiconductor ASA today announces the release of the world's first multi-protocol SoC solution offering concurrent ANT+ and Bluetooth low energy wireless communication natively in a single chip.

10/02/2013  A pair of breakthroughs in the field of silicon photonics by researchers at the University of Colorado Boulder, the Massachusetts Institute of Technology and Micron Technology Inc. could allow for the trajectory of exponential improvement in microprocessors that began nearly half a century ago—known as Moore's Law—to continue well into the future, allowing for increasingly faster electronics, from supercomputers to laptops to smartphones.

10/02/2013  Emphasis on fabless and fab-lite models in U.S. contributes to 62% marketshare.

10/01/2013  Semiconductor wet processes, etches and cleans, resist spin coatings and films the first services available

09/30/2013  The Fraunhofer Institute for Solar Energy Systems ISE, Soitec, CEA-Leti and the Helmholtz Center Berlin jointly announced this week having achieved a new world record for the conversion of sunlight into electricity using a new solar cell structure with four solar subcells.

09/30/2013  Alpha and Omega Semiconductor, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today launched the AOZ5019, a third-generation high efficiency power module with an EZPair package.

09/26/2013  GE Healthcare Finland Oy, in partnership with GE Idea Works, announced today that it has completed the acquisition of Imbera Electronics Oy.

09/26/2013  Fujifilm and imec have developed a new photoresist technology for organic semiconductors that enables the realization of submicron patterns.

09/25/2013  Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.

09/25/2013  Micron Technology, Inc. announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples.

09/24/2013  Applied Materials Inc. and Tokyo Electron Limited today announced Applied Materials agreed to merge with Tokyo Electron.

09/24/2013  MACOM Technology Solutions Inc., a supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products.