09/05/2013  Some unexpected underdogs spur spending spree.

09/05/2013  The history of semiconductors has been a history of collaboration. Today, a similar industry-wide collaborative approach to 3D stacked ICs is needed to reach widespread 3D-IC adoption and continue the amazing progress our industry has historically achieved.

09/05/2013  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, will honor professors from Stanford University and University of Texas at Austin with awards for chip-related research and education at SRC’s annual TECHCON conference Sept. 9-10.

09/04/2013  Researchers in the College of Engineering at Oregon State University have made a significant advance in the function of metal-insulator-metal, or MIM diodes, a technology premised on the assumption that the speed of electrons moving through silicon is simply too slow.

09/04/2013  EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via semiconductor packaging applications.

09/03/2013  Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

09/03/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network of top technology providers to support EVG's LowTemp platform for room-temperature wafer bonding and debonding processes.

08/30/2013  Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about recent predictions regarding the demise of continued scaling.

08/30/2013  Worldwide PC shipments are now expected to fall by -9.7 percent in 2013, further deepening what is already the longest market contraction on record.

08/28/2013 

Entegris, Inc. and imec announced they are collaborating to advance the development and broaden the adoption of 3D integrated circuits.

08/27/2013 

RFMD today announced it has shipped more than one million RF7196D high-power, high-efficiency CMOS power amplifiers (PAs).

08/14/2013 

Samsung today introduced the first solid state drive (SSD) based on its recently released 3D V-NAND technology. Samsung announced its new SSD, designed for use in enterprise servers and data centers, during a keynote at the Flash Memory Summit 2013.

08/06/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about Samsung's recent announcement on 3D vertical NAND.

08/06/2013 

New technology represents a breakthrough in overcoming NAND scaling limit and ushers in a new 3D memory era.

08/01/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about the appearance of 3D integration on several roadmaps.

08/01/2013 

Cascade Microtech, Inc. and imec today announced breakthroughs in probing stacked integrated circuits (3D-SICs), fueling an important growth engine for the semiconductor market.

07/31/2013 

Toshiba Corporation and Amkor Technology, Inc. today announced that the companies have completed Amkor’s acquisition of Toshiba Electronics Malaysia Sdn. Bhd., Toshiba’s semiconductor packaging operation in Malaysia.

07/31/2013 

Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies. 

07/30/2013 

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

07/28/2013  Bit-growth slows while specialized stacking accelerates innovation in future memory solutions for communications, energy, and health-care.