08/22/2018  Integrated Device Technology, Inc. announced today a strategic partnership with Steradian Semiconductor Pvt. Ltd. to deliver ultra-high resolution 4D mmWave imaging RADAR for emerging industrial, security, medical, and autonomous vehicle markets.

08/22/2018  Discovery could have major impact on semiconductor industry.

08/21/2018  MRSI Systems (Mycronic Group), is expanding its high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC).

08/21/2018  Soitec (Euronext Paris), a designer and manufacturer of semiconductor materials, and MBDA, announce the joint acquisition of Dolphin Integration.

08/20/2018  New devices increase power supply efficiency even further.

08/17/2018  The Trump administration's consideration of tariffs on Chinese printed circuit assemblies and connected devices would cost the economy $520.8 million and $2.4 billion annually for the 10 percent and 25 percent tariffs, respectively, according to a new study commissioned by the Consumer Technology Association (CTA).

08/15/2018  pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, introduces the world’s first monolithic, silicon-on-insulator (SOI) Wi-Fi front-end module.

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

08/14/2018  TowerJazz, the global specialty foundry, announced details of its China Technical Global Symposium (TGS) event in Shanghai on August 22, 2018.

08/13/2018  This acquisition establishes Keysight as the largest calibration and support services organization in Australia.

08/09/2018  With 24% IC marketshare, DRAM expected to account for nearly one in four IC sales dollars spent.

08/08/2018  TDK Corporation has developed the new MPZ0603-H series of multilayer chip beads for power lines in an IEC 0603 package that feature twice the rated current and about half the DC resistance of the existing MPZ0603-C series.

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

08/07/2018  Achronix Semiconductor Corporation today announced availability of an optimized High-Level Synthesis (HLS) flow from its partner, Mentor, a Siemens business, for its FPGA technology products.

08/06/2018  Q2 sales are highest on record, 6.0 percent more than previous quarter, 20.5 percent higher than Q2 of last year.

08/06/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass producing the industry’s first 4-bit (QLC, quad-level cell) 4-terabyte (TB) SATA solid-state drive (SSD) for consumers.

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

08/02/2018  Partnership enables UMC to develop and manufacture products utilizing Invensas DBI and ZiBond technologies.

08/02/2018  Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

07/31/2018  New packaging provides double-sided cooling for improved heat dissipation.