Process Materials

PROCESS MATERIALS ARTICLES



Imec develops 3D-compatible germanium nMOS gate stack with high mobility and superior reliability

12/08/2016  At this week's IEEE IEDM conference, imec, the research and innovation hub in nano-electronics and digital technologies showed for the first time a silicon (Si)-passivated germanium (Ge) nMOS gate stack with dramatically reduced interface defect density (DIT) reaching the same level as a Si gate stack and with high mobility and reduced positive bias temperature instability (PBTI).

Stanford engineers find that a new memory technology may be more energy efficient than previously thought

12/07/2016  While exploring the atomic-level forces at play in a new type of computer chip, researchers found an energy-saving surprise that could translate into longer battery life for next-generation mobile devices.

3-D solutions to energy savings in silicon power transistors

12/05/2016  K Tsutsui at Tokyo Institute of Technology and colleagues in Japan have now shown that by scaling down size parameters in all three dimensions their device they can achieve significant energy savings.

Simple processing technique could cut cost of organic PV and wearable electronics

12/05/2016  A simple solution-based electrical doping technique could help reduce the cost of polymer solar cells and organic electronic devices, potentially expanding the applications for these technologies.

Making graphene using laser-induced phase separation

12/02/2016  IBS & KAIST researchers clarify how laser annealing technology can lead to production of ultra thin nanomaterials.

Physicists decipher electronic properties of materials in work that may change transistors

12/02/2016  University of Texas at Dallas physicists have published new findings examining the electrical properties of materials that could be harnessed for next-generation transistors and electronics.

Perovskite solar cells hit new world efficiency record

12/01/2016  12.1 percent efficiency for 16 cm2 cell is the largest single to be independently certified with highest energy conversion efficiency.

Creating new physical properties in materials

11/30/2016  Collaborating German institutions bring complementary expertise to demonstrate piezoelectricity in SrTiO3.

Global carbon nanotubes market to grow at 17.9% CAGR through 2025

11/22/2016  The global market for nanotubes was valued at $1,250.00 million in 2015 and is expected to grow at a CAGR of 17.9% during the forecast period 2016-2025.

UCR researchers discover new method to dissipate heat in electronic devices

11/14/2016  By modulating the flow of phonons through semiconductor nanowires, engineers can create smaller and faster devices.

Nano-scale electronics score laboratory victory

11/10/2016  NYU Tandon researchers pioneer technique to grow monolayer tungsten disulfide for next-generation transistors, wearable electronics, and biomedical devices.

Studying structure to understand function within 'material families'

11/09/2016  Researchers are running structural studies using extensive numerical simulations on a supercomputer to study the motion of more than 500 atoms -- in an effort to determine the forces on each atom and the total energy via density functional calculations.

Semiconductor-free microelectronics are now possible, thanks to metamaterials

11/09/2016  Engineers at the University of California San Diego have fabricated the first semiconductor-free, optically-controlled microelectronic device.

Third quarter 2016 silicon wafer shipments set a new record

11/09/2016  Worldwide silicon wafer area shipments increased during the third quarter 2016 when compared to second quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

New record for silicon-based multi-junction solar cell

11/09/2016  Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an efficiency exceeding the theoretical limit of silicon solar cells.

SunEdison Semiconductor announces regulatory approvals from Taiwan and Austria for proposed acquisition

11/07/2016  SunEdison Semiconductor Limited announced today that it has received notice that the Investment Committee of the Ministry of the Economic Affairs of the Republic of China has approved the proposed acquisition of SunEdison Semiconductor by GlobalWafers Co., Ltd.

'Pressure-welding' nanotubes creates ultrastrong material

11/07/2016  Scientists at MIPT apply torsion to multiwall nanotubes to form bonds between them creating durable material.

Adding hydrogen to graphene

11/03/2016  Adding hydrogen to graphene could improve its future applicability in the semiconductor industry, when silicon leaves off.

Edwards and GlobalFoundries recognized by Singapore's National Environmental Agency

11/01/2016  Edwards and GlobalFoundries Singapore were recognized by Singapore’s National Environment Agency in the Best Practices category at the 2016 Energy Efficiency National Partnership (EENP) Awards.

van der Pauw and Hall voltage measurements with a parameter analyzer

10/31/2016  van der Pauw measurements with a parameter analyzer are examined followed by a look at Hall effects measurements.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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