Process Materials

PROCESS MATERIALS ARTICLES



Transmitting energy in soft materials

08/09/2016  A new way to send mechanical signals through soft materials.

NREL technique leads to improved perovskite solar cells

08/09/2016  Scientists at the Energy Department's National Renewable Energy Laboratory (NREL), in collaboration with researchers at Shanghai Jiao Tong University (SJTU), devised a method to improve perovskite solar cells, making them more efficient and reliable with higher reproducibility.

Smarter self-assembly opens new pathways for nanotechnology

08/08/2016  To continue advancing, next-generation electronic devices must fully exploit the nanoscale, where materials span just billionths of a meter. But balancing complexity, precision, and manufacturing scalability on such fantastically small scales is inevitably difficult.

Carbon nanotube 'stitches' make stronger, lighter composites

08/03/2016  Method to reinforce these materials could help make airplane frames lighter, more damage-resistant.

New nontoxic process promises larger ultrathin sheets of 2-D nanomaterials

07/27/2016  A team of scientists led by the Department of Energy's Oak Ridge National Laboratory has developed a novel way to produce two-dimensional nanosheets by separating bulk materials with nontoxic liquid nitrogen.

Utah and Minnesota engineers discover highly conductive materials for more efficient electronics

07/27/2016  Engineers from the University of Utah and the University of Minnesota have discovered that interfacing two particular oxide-based materials makes them highly conductive, a boon for future electronics that could result in much more power-efficient laptops, electric cars and home appliances that also don't need cumbersome power supplies.

Ultra-flat circuits will have unique properties

07/25/2016  Rice University lab studies 2-D hybrids to see how they differ from common electronics.

Integration of novel materials with silicon chips makes new 'smart' devices possible

07/21/2016  Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.

Quantum drag

07/20/2016  University of Iowa physicist says current in one iron magnetic sheet can create quantized spin waves in another, separate sheet.

Scientists glimpse inner workings of atomically thin transistors

07/19/2016  With an eye to the next generation of tech gadgetry, a team of physicists at The University of Texas at Austin has had the first-ever glimpse into what happens inside an atomically thin semiconductor device.

Graphene photodetectors: Thinking outside the 2-D box

07/18/2016  The efficient detection of low-energy photons constitutes one of the main challenges faced by future optoelectronics. Finding new ways of sensing and harvesting these photons is crucial for the development of technologies such as silicon photonics, pollution sensing and next-generation solar.

New materials need new handling approaches

07/13/2016  Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.

Cisco's Kern on digitizing business processes

07/13/2016  Cisco VP urges conference goers to invest in digitized supply chains to stay relevant.

Imec and Synopsys collaborate on interconnect resistivity model

07/11/2016  Synopsys' Process Explorer and Raphael accurately simulate parasitic resistance of alternative metals and liner-barrier materials at the 7nm node and beyond.

3D-Micromac releases new laser micromachining solution to volume semiconductor wafer and power device processing

07/08/2016  3D-Micromac AG announced that its microDICE laser micromachining system has been adopted by a major industrial manufacturer for volume production of high-power diodes.

Integrated trio of 2-D nanomaterials unlocks graphene electronics applications

07/05/2016  Voltage-controlled oscillator developed at UC Riverside could be used in thousands of applications from computers to wearable technologies.

Electronic gases market undergoing major shifts

06/30/2016  Techcet forecasts $3.9B gas business for 2016.

Diamond-based resonators might become highly sensitive detectors

06/22/2016  Physicists from the Technological Institute for Superhard and Novel Carbon Materials, the Moscow Institute of Physics and Technology, and the Siberian Federal University have mathematically modelled diamond-based microstructures for producing compact high sensitivity sensors.

Accelerate and de-risk materials decisions for semiconductor R&D with IMI Labs from Intermolecular

06/21/2016  Intermolecular, Inc. today announced IMI Labs for Semiconductor, a materials innovation service to help semiconductor companies explore, discover and characterize new materials.

Imec demonstrates gate-all-around MOSFETs with lateral silicon nanowires at scaled dimensions

06/16/2016  Today, at the 2016 Symposia on VLSI Technology & Circuits, nano-electronics research center imec presented gate-all-around (GAA) n- and p-MOSFET devices made of vertically stacked horizontal silicon (Si) nanowires (NWs) with a diameter of only 8nm.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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