Process Materials

PROCESS MATERIALS ARTICLES



Bismuth-based nanoribbons show 'topological' transport, potential for new technologies

01/19/2016  Researchers have created nanoribbons of an emerging class of materials called topological insulators and used a magnetic field to control their semiconductor properties, a step toward harnessing the technology to study exotic physics and building new spintronic devices or quantum computers.

Uncovering oxygen's role in enhancing red LEDs

01/13/2016  While oxygen can impede the effectiveness of gallium nitride (GaN), an enabling material for LEDs, small amounts of oxygen in some cases are needed to enhance the devices' optical properties.

Stanford researchers advance area selective ALD to develop more energy efficient electronics

01/12/2016  Stanford University researchers sponsored by Semiconductor Research Corporation (SRC) have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors.

Visualizing atoms of perovskite crystals

01/08/2016  OIST researchers conduct the first atomic resolution study of perovskites used in next generation solar cells.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

Electronically connected graphene nanoribbons foresee high-speed electronics

01/08/2016  Chemical interconnection bridges electronic properties of graphene-nanoribbons with zigzag-edge features.

Researchers gauge quantum properties of nanotubes, essential for next-gen electronics

01/07/2016  Imaging method allowed researchers to measure the nanotube quantum capacitance-a very unique property of an object from the nano-world.

The Critical Materials Council to be managed by TECHCET in 2016

01/07/2016  The Critical Materials Council for Semiconductor Fabricators, originally established by ISMI/SEMATECH in the early 1990’s, will be managed by TECHCET CA LLC starting January 01, 2016.

Promising new approach for controlled fabrication of carbon nanostructures

01/05/2016  An international team of researchers including Professor Federico Rosei and members of his group at INRS has developed a new strategy for fabricating atomically controlled carbon nanostructures used in molecular carbon-based electronics.

Choreographing the dance of electrons

01/04/2016  NUS scientists have discovered how to manipulate electrons in thin semiconductors by encapsulating them in atomically thin materials and changing the electric field.

New device uses carbon nanotubes to snag molecules

12/22/2015  Engineers at MIT have devised a new technique for trapping hard-to-detect molecules, using forests of carbon nanotubes.

Building blocks for GaN power switches

12/15/2015  A team of engineers from Cornell University, the University of Notre Dame and the semiconductor company IQE has created gallium nitride (GaN) power diodes capable of serving as the building blocks for future GaN power switches -- with applications spanning nearly all electronics products and electricity distribution infrastructures.

Imec advances 200mm GaN-on-Si tech closer to manufacturing

12/14/2015  At last week’s IEEE International Electron Devices Meeting 2015, nano-electronics research center imec presented three novel aluminum gallium nitride (AlGaN)/ gallium nitride (GaN) stacks featuring optimized low dispersion buffer designs.

Imec boosts performance of beyond-silicon devices

12/10/2015  At this week’s IEEE IEDM conference, nano-electronics research center imec demonstrates record enhancement of novel InGaAs Gate-All-Around (GAA) channel devices integrated on 300mm Silicon and explores emerging tunnel devices based on optimization of the same III-V compound semiconductor.

Researchers find new phase of carbon, create diamond at room temp

12/01/2015  Researchers from North Carolina State University have discovered a new phase of solid carbon, called Q-carbon, which is distinct from the known phases of graphite and diamond.

Silicon shipment levels decline in third quarter 2015

11/13/2015  Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SEMI announces continued annual growth for silicon shipment volumes

10/22/2015  Total wafer shipments this year are expected to exceed the market high set in 2014 and are forecast to continue shipping at record levels in 2016 and 2017.

Is silicon’s heyday over? New materials challenge the industry workhorse

07/14/2015  The short answer to that headline’s question is “no.” Longer term, in going beyond the 5-nanometer process node, silicon may finally reach the end of its usefulness to the semiconductor industry.

Future electronics based on carbon nanotubes

04/07/2015  The exceptional properties of tiny molecular cylinders known as carbon nanotubes have tantalized researchers for years because of the possibility they could serve as a successors to silicon in laying the logic for smaller, faster and cheaper electronic devices.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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