07/20/2018  Storage and memory chipmaker and SEMI China member Tsinghua Unigroup is gearing up to meet burgeoning product demand with huge investments in its manufacturing plants.

07/19/2018  Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

07/19/2018  A new theoretical study explains previous mystifying experimental results, in which coupled charged particles moved in exactly the opposite direction to that predicted. This apparently contradictory phenomenon is associated with the bandgap in dual-layer graphene structures, a bandgap which is very much smaller than in conventional semiconductors.

07/19/2018  New material draws heat away from hotspots much faster than current materials.

07/18/2018  The international team of scientist found a way to improve nanocomposite material to use it in hydrogen economy.

07/17/2018  Scientists at NUS have discovered a new way to closely look at the electronic quantum behaviour of materials, giving a deeper understanding of how they could be used for future quantum computing applications.

07/12/2018  Nitrous oxide (N2O) has a variety of uses in the semiconductor manufacturing industry. It is the oxygen source for chemical vapor deposition of silicon oxy-nitride (doped or undoped) or silicon dioxide, where it is used in conjunction with deposition gases such as silane.

07/11/2018  Industry-inclusive hub promotes early collaboration and learning from substrate to system level.

07/11/2018  Intel has won SEMI's 2018 Award for the Americas. SEMI honored the celebrated chipmaker for pioneering process and integration breakthroughs that enabled the first high-volume Integrated Silicon Photonics Transceiver. The award was presented yesterday at SEMICON West 2018.

07/11/2018  SEMI yesterday honored two industry leaders at SEMICON West 2018 for their outstanding accomplishments in developing Standards for the electronics and related industries.

07/10/2018  Increasingly complicated 3D structures such finFETs and 3D NAND require very high aspect ratio etches. This, in turn, calls for higher gas flow rates to improve selectivity and profile control. Higher gas flow rates also mean higher etch rates, which help throughput, and  higher rates of removal for etch byproducts.

07/09/2018  To eliminate voids, it is important to control the process to minimize moisture absorption and optimize a curing profile for die attach materials.

07/06/2018  Researchers at the University of Texas at Dallas and their collaborators have created and characterized tiny crystals of boron arsenide.

07/03/2018  A Tokyo Institute of Technology research team has shown copper nitride acts as an n-type semiconductor, with p-type conduction provided by fluorine doping, utilizing a unique nitriding technique applicable for mass production and a computational search for appropriate doping elements, as well as atomically resolved microscopy and electronic structure analysis using synchrotron radiation.

06/29/2018  New metrology and inspection technologies and new analysis approaches made possible by improving compute technology offer solutions to finding the increasingly subtle variations in materials and subsystems that meet specifications but still cause defects on the wafer. More collaboration across the supply chain is helping too.  SEMICON West programs on materials and subsystems will address these issues.   

06/29/2018  Using molecular dynamics, researchers demonstrate the possible role of nitrogen as a major contributor to dislocation-related effects in gallium nitride-based devices.

06/28/2018  The Linde Group, a supplier of electronic materials, is investing in the expansion of existing products to improve business continuity planning (BCP), while adding new products with improved purity to meet the growing needs of sub-10nm semiconductor factories and advanced flat panel manufacturers.

06/28/2018  Researchers at Tokyo Institute of Technology have developed flexible terahertz imagers based on chemically "tunable" carbon nanotube materials. The findings expand the scope of terahertz applications to include wrap-around, wearable technologies as well as large-area photonic devices.

06/28/2018  SEMI today announced the formation of the SEMI Electronic Materials Group (EMG), a new collaborative technology community that combines the former Chemical & Gas Manufacturers Group (CGMG), the Silicon Manufacturers Group (SMG) and other SEMI member segments to better serve the interests of the electronics materials industry.

06/27/2018  New rare-metal-free photocatalyst turns CO2 into carbon resource.