Process Materials

PROCESS MATERIALS ARTICLES



Entegris acquires Flex Concepts

06/27/2018  Entegris, Inc., a developer of specialty chemicals and advanced materials solutions for the microelectronics industry, announced today that it acquired Flex Concepts, Inc., a technology company focused on bioprocessing single-use bags, and fluid transfer solutions for the life sciences industry. 

TowerJazz announces RF SOI 65nm ramp in its 300mm fab

06/27/2018  TowerJazz, the global specialty foundry, today announced a ramp for its radio frequency silicon-on-insulator (RF SOI) 65nm process in its 300mm Uozu, Japan fab.

Template to create superatoms, created by VCU researchers, could make for better batteries

06/22/2018  he superatoms -- combinations of atoms that can mimic the properties of more than one group of elements of the period table -- could be used to improve semiconductors found in computerized devices.

Graphene assembled film shows higher thermal conductivity than graphite film

06/21/2018  Researchers at Chalmers University of Technology, Sweden, have developed a graphene assembled film that has over 60 percent higher thermal conductivity than graphite film -- despite the fact that graphite simply consists of many layers of graphene. The graphene film shows great potential as a novel heat spreading material for form-factor driven electronics and other high power-driven systems.

The fingerprints of harmful molecules could be detected noninvasively via black silicon

06/20/2018  Scientists of the Far Eastern Federal University (FEFU) in cooperation with colleagues from the Russian Academy of Sciences (RAS), Australian and Lithuanian Universities have improved the technique of ultrasensitive nonperturbing spectroscopic identification of molecular fingerprints.

Interaction of paired and lined-up electrons can be manipulated in semiconductors

06/20/2018  The way that electrons paired as composite particles or arranged in lines interact with each other within a semiconductor provides new design opportunities for electronics, according to recent findings in Nature Communications.

Could this material enable autonomous vehicles to come to market sooner?

06/19/2018  New material has optical properties that could enable better infrared detection for autonomous vehicles and assist firefighters.

WIN Semiconductors releases new platform integrating high performance 0.1um GaAs pHEMT with monolithic PIN and vertical Schottky diodes

06/13/2018  WIN Semiconductors Corp, the world's largest pure-play compound semiconductor foundry, has expanded its portfolio of highly integrated GaAs technologies with the release of a new pHEMT technology.

Entegris announces agreement to acquire SAES Pure Gas business

06/07/2018  Entegris, Inc., a distributor of specialty chemicals and advanced materials solutions, announced today it has entered into a definitive agreement to acquire the SAES Pure Gas business.

Fungi-produced pigment shows promise as semiconductor material

06/06/2018  Researchers at Oregon State University are looking at a highly durable organic pigment, used by humans in artwork for hundreds of years, as a promising possibility as a semiconductor material.

Applied Materials breakthrough accelerates chip performance in the big data and AI era

06/05/2018  Applied Materials, Inc. today announced a breakthrough in materials engineering that accelerates chip performance in the big data and AI era.

Physicists devise method to reveal how light affects materials

06/05/2018  The new method adds to the understanding of the fundamental laws governing the interaction of electrons and light.

MIT researchers devise new way to make light interact with matter

06/04/2018  Reducing the wavelength of light could allow it to be absorbed or emitted by a semiconductor, study suggests.

Imec extends damascene metallization towards the 3nm technology node

06/04/2018  At this week’s 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec will present 11 papers on advanced interconnects, ranging from extending Cu and Co damascene metallization, all the way to evaluating new alternatives such as Ru and graphene.

Graphene layered with magnetic materials could drive ultrathin spintronics

05/30/2018  Measurements at Berkeley Lab's Molecular Foundry reveal exotic spin properties that could drive new form of data storage.

Building nanomaterials for next-generation computing

05/30/2018  Scientists recently developed a blueprint to fabricate new nanoheterostructures using 2-D materials.

Polymer crystals hold key to record-breaking energy transport

05/25/2018  Scientists from the universities of Bristol and Cambridge have found a way to create polymeric semiconductor nanostructures that absorb light and transport its energy further than previously observed.

Rare element to provide better material for high-speed electronics

05/25/2018  Purdue researchers have discovered a new two-dimensional material, derived from the rare element tellurium, to make transistors that carry a current better throughout a computer chip.

Silicon breakthrough could make key microwave technology much cheaper and better

05/24/2018  Researchers using powerful supercomputers have found a way to generate microwaves with inexpensive silicon, a breakthrough that could dramatically cut costs and improve devices such as sensors in self-driving vehicles.

Next generation dopant gas delivery system for ion implant applications

05/24/2018  A new class of adsorbent materials offer high capacity storage and safe delivery of dopant gases.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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