06/22/2016  Emerging opportunities for advanced packaging solutions for heterogeneous integration include a lot more than logic, memory and sensors.

06/21/2016  Each year at SEMICON West, the "Best of West" awards are presented by Solid State Technology and SEMI.

06/14/2016  Today, SEMI announced that the latest packaging solutions will be the topic of an in-depth session at the SEMICON West 2016 Advanced Packaging Forum - and on display on the exhibition floor.

06/13/2016  The changing market for ICs means the end of business as usual for the greater semiconductor supply chain. Smarter use of data analytics looks like a key strategy to get new products more quickly into high yield production at improved margins.

06/10/2016  A forum of industry experts at SEMICON West 2016 will discuss the challenges associated with getting from node 10 -- which seems set for HVM -- to nodes 7 and 5.

05/26/2016  As the opening day of SEMICON West (July 12-14) approaches, the electronics manufacturing industry is experiencing disruptive changes, making “business as usual” a thing of the past. To help technical and business professionals navigate this fast-changing landscape, SEMICON West programming has been upgraded extensively.

05/12/2016  Qualcomm, Micron, and SK Hynix registered ?25% drops, with total top-20 sales off by 6%.

04/29/2016  The demand for smartphones and other portable devices that need efficient power management is driving the analog IC market, as is the Internet of Things (IoT) and the MEMS/sensors devices that enable it.

04/18/2016  Leading innovators in today's integrated electronics supply chain are preparing to showcase their products and services at SEMICON West 2016 on July 12-14 in San Francisco, Calif.

04/14/2016  Celebrating its 70th anniversary, Brooks Instrument will be exhibiting at SEMICON West 2016 with new mass flow controllers (MFC) equipped with the high-speed EtherCAT interface, along with a broad range of other mass flow meters, controllers, vaporizers and capacitance manometers for semiconductor manufacturing.

10/07/2015  SEMI announced today that FlexTech Alliance has become the first SEMI Strategic (Association) Partner.

08/11/2015  Leading industry experts participated in the joint SEMI-MEMS Industry Group (MIG) workshop during SEMICON West 2015 to discuss industry challenges – and potential solutions and collaborative approaches – in the MEMS, sensors and semiconductor industries.

07/31/2015  SEMICON West 2015 had a strong and rich undercurrent – the roadmap forward is most certainly 3DIC.

07/16/2015  CH2M has seen many changes and trends in the semiconductor industry since the company was involved designing many of the industry’s first wafer fabs back in the 1980s.

07/16/2015  Semiconductor test equipment and inspection/metrology equipment are unglamorous yet critical segments of the equipment field.

07/16/2015  Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

07/16/2015  Imagine EUV lithography in high volume production. ASML has been working for years to make it happen.

07/15/2015  Check out these events on Day 3 of SEMICON West 2015.

07/15/2015  The ClassOne Technology Solstice S4 won the Best of West award, presented by Solid State Technology and SEMI.

07/15/2015  SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.