Semicon West

SEMICON WEST ARTICLES



Strong dollar to create economic uncertainties in global market

07/13/2015  Presentations at the SEMI/Gartner Market Symposium on Monday afternoon could be summed up in two words: Uncertainties Ahead.

Advanced packaging, 3DICs to figure in SEMICON West discussions

07/13/2015  The era of three-dimensional chips is upon us.

Genmark Automation launches CODEX Stocker

07/13/2015  Genmark Automation, a developer of tool and factory automation solutions for the semiconductor and related industries, today announced the launch of its new CODEX Stocker.

Leti reports FinFET feasibility and circuit design with CoolCube tech

07/13/2015  CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power.

Immersion lithography remains the industry’s workhorse technology

07/08/2015  While the lithography equipment market sometimes seems like A Tale of Two Cities, it’s more complicated than that. The basic fact is that the semiconductor industry is soldiering on with 193-nanometer immersion lithography technology and multiple-patterning exposures while extreme-ultraviolet lithography continues its long-aborning development.

SEMI updates key safety guidelines for semiconductor manufacturing equipment

07/08/2015  SEMI today announced the cornerstone safety Standard S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) will be updated this month.

Etching: A crucial step in semiconductor manufacturing

07/08/2015  Plasma etching is a key step in wafer fabrication, from deposition to the patterning of photolithography to dry or wet etch. As such, it is a crucial and hotly-contested area for vendors of semiconductor manufacturing equipment.

Deposition equipment market witnesses a year of significant changes

07/08/2015  There are four main segments in the thin-layer deposition equipment market – atomic layer deposition, chemical vapor deposition, epitaxy, and physical vapor deposition, also known as sputtering.

The latest in CMP tech will be on offer at SEMICON West

07/08/2015  Chemical mechanical planarization (CMP) technology has been around for a long time. In addition to the semiconductor industry, CMP has applications in data storage, polishing the rigid disks and magnetic heads of hard-disk drives.

The big picture: More than 850 volume fabs in 2017

07/06/2015  We, in the semiconductor supply chain, are constantly immersed in detailed numbers. It’s important to pull back and look at the major trends that have profoundly changed and are reshaping our industry.

Tackling advanced litho challenges on the path to node 5

07/02/2015  If you attended just about any mask making conference in the last five to seven years, you would have heard the lament about exploding data volumes and their impact on mask writing time and, by extension, mask costs.

SEMI and Solid State Technology announce the 2015 ?Best of West? Award finalists

06/30/2015  The award was established to recognize new products moving the industry forward with technological developments in the microelectronics supply chain.

“What’s next?” ? Advances in technology at SEMICON West 2015

06/25/2015  The latest manufacturing, materials and production developments in semiconductor and related technologies will be featured at SEMICON West 2015 on July 14-16 at Moscone Center in San Francisco, Calif.

Startups find strategic investors at SEMICON West 2015

06/15/2015  SEMI today announced that SEMICON West 2015 will feature the Silicon Innovation Forum (SIF), a unique forum for strategic investors and key decision makers to meet new and emerging early-stage companies developing the future of microelectronics.

More change for the chip industry

06/11/2015  As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.

Fab equipment growth continues into 2015

06/04/2015  Fab equipment spending is forecast to depart from the typical historic trend over the past 15 years of two years of spending growth followed by one of decline. For the first time, equipment spending could grow every year for three years in a row: 2014, 2015, and 2016.

North America: A critical player in the advanced semiconductor market

06/01/2015  As the fabless business model has transformed the semiconductor manufacturing landscape, Taiwan and South Korea have undeniably grown into key semiconductor producing regions. However, it should be noted that North America is home to Intel, Texas Instruments, Micron, GLOBALFOUNDRIES, Freescale, Fairchild, Microchip, ON Semiconductor, significant operations of Samsung, and other manufacturers.

Diverse packaging and test issues up for debate at SEMICON West 2015

05/29/2015  SEMI this week announced the SEMICON West 2015 test and packaging program agendas.

3D NAND, MRAM, RRAM: Emerging opportunities and challenges for the changing memory market

05/21/2015  Ever growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies.

SEMICON West 2015 focuses on the most critical issues in semiconductor manufacturing

05/15/2015  SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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