Semiconductors

SEMICONDUCTORS ARTICLES



Penn engineers develop first transistors made entirely of nanocrystal 'inks'

04/08/2016  University of Pennsylvania engineers have shown a new approach for making these devices: sequentially depositing their components in the form of liquid nanocrystal "inks."

Quantum dots enhance light-to-current conversion in layered semiconductors

04/08/2016  Harnessing the power of the sun and creating light-harvesting or light-sensing devices requires a material that both absorbs light efficiently and converts the energy to highly mobile electrical current.

Rudolph adds high-speed 3D metrology to the NSX Series for advanced packaging process control

04/07/2016  Rudolph Technologies, Inc. today announced the availability of new, high-speed 3D metrology on its flagship NSX Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects.

Semiconductor market in Vietnam up by 14.3% by 2019

04/07/2016  SEMI, the global industry association serving the electronics manufacturing supply chain, will include programs pertinent to Vietnam’s semiconductor industry at the upcoming SEMICON SEA 2016, the region’s premier showcase for microelectronics innovation.

SIA's VP of Global Policy to address China's new role in the semiconductor industry at The ConFab 2016

04/06/2016  Solid State Technology is pleased to announced that Jimmy Goodrich of the Semiconductor Industry Association is the latest distinguished guest confirmed to speak at The ConFab 2016.

Worldwide semiconductor wafer-level manufacturing equipment market declined 1% in 2015

04/06/2016  Worldwide semiconductor wafer-level manufacturing equipment revenue totaled $33.6 billion in 2015, a 1 percent decline from 2014, according to final results by Gartner, Inc.

NREL reveals potential for capturing waste heat via nanotubes

04/06/2016  A finely tuned carbon nanotube thin film has the potential to act as a thermoelectric power generator that captures and uses waste heat, according to researchers at the Energy Department's National Renewable Energy Laboratory (NREL).

Entegris appoints new Senior Vice President and General Counsel

04/05/2016  Ms. Lee is assuming the role from Peter Walcott, who is retiring after a 35-year career with Entegris and its predecessor companies.

TowerJazz announces its SiGe Terabit Platform

04/05/2016  TowerJazz, the global specialty foundry, today announced its SiGe Terabit Platform targeting high-speed wireline communications for the terabit age.

U.S. companies continue to capture bulk of IDM and fabless IC sales

04/05/2016  IC Insights recently released its March Update to the 2016 McClean Report. The Update includes a review of IC company sales by headquarters location.

Samsung starts mass producing industry's first 10nm class DRAM

04/05/2016  Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 10-nanometer (nm) class, 8-gigabit (Gb) DDR4 (double-data-rate-4) DRAM chips and the modules derived from them.

IEEE Photonics Society's Issues Call for Papers for 13th International Group IV Photonics Conference

04/04/2016  The 2016 International Group IV Photonics Conference, sponsored by the IEEE Photonics Society, has announced the Call for Papers seeking original research on the Novel Materials & Nanophotonics; Photonic Devices; and Silicon Photonics Applications & Systems.

Nanotubes line up to form films

04/04/2016  A simple filtration process helped Rice University researchers create flexible, wafer-scale films of highly aligned and closely packed carbon nanotubes.

Update on neon shortage 2016 highlighted at the Critical Materials Conference

04/04/2016  Communication with suppliers in the Ukraine and China have continued to verify expected shortages occurring toward the end of 2016. Although supply appears stable now, inventories purchased during the second half of 2015 will deplete inventories on the supplier side toward the end of this year.

Global semiconductor sales dip slightly in February

04/04/2016  Sales decrease 3.2 percent month-to-month and 6.2 percent year-to-year.

Global semiconductor market slumps in 2015, IHS reports

04/04/2016  Weakness in end-market demand will cause revenue decay to extend into 2016 and beyond.

ON Semiconductor extends offer to acquire Fairchild Semiconductor - again

04/01/2016  The offer will now expire one minute following 11:59 p.m., New York City time, on April 14, 2016, unless further extended as required or permitted by the merger agreement.

Intel Custom Foundry certifies Synopsys tools for 10nm tri-gate process

04/01/2016  Synopsys, Inc. announced Intel Custom Foundry's certification of digital and signoff implementation tools from the Synopsys Galaxy Design Platform for Intel's 10nm tri-gate process technology.

Molecular-scale ALD discovery could have industrial-sized impact

03/31/2016  In the world of nano-scale technology, where work is conducted at the atomic level, even the smallest changes can have an enormous impact. And a new discovery by a University of Alberta materials engineering researchers has caught the attention of electronics industry leaders looking for more efficient manufacturing processes.

China's semiconductor strategy

03/30/2016  China has become the largest and the fastest growing market in the world. 40% of the worldwide semiconductor shipments go to China and that’s expected to increase to almost 42% in 2019.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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