Semiconductors

SEMICONDUCTORS ARTICLES



Managing hazardous process exhausts in high volume manufacturing

03/30/2016  Integrated sub-fab systems allow HVM fab operators to safely and efficiently implement new processes containing hazardous process chemicals.

Chipmakers seek solution to neon gas supply shortage

03/30/2016  Finding a short term solution to the neon gas shortage problem will be challenging.

Impact of triboelectric charging from DI water on transistor gate damage

03/30/2016  Optimized settings for DI water pressure at CMP and careful analysis of interconnect layout are used to improve quality on a complex analog design.

New magnet discovered

03/30/2016  A group of researchers from Osaka University and The University of Tokyo discovered a new magnet capable of controlling Dirac fermions with zero mass.

Mixed signal and IoT driving ASIC design starts growth, says Semico Research

03/29/2016  Steady demand in existing end markets and growth from new end applications are pushing ASIC design activity to new levels.

ACM demonstrates damage-free cleaning technology on 1Xnm patterned wafer

03/28/2016  ACM Research (Shanghai), Inc. has announced that it has solved the problem of patterned wafer cleaning.

TSMC and Nanjing sign 12-inch fab investment agreement

03/28/2016  TSMC today announced that the Company and the municipal government of Nanjing, China have signed an investment agreement.

How finFETs ended the service contract of silicide process

03/25/2016  A look into how the silicide process has evolved over the years, trying to cope with the progress in scaling technology and why it could no longer be of service to finFET devices.

Trace metal contamination: Choosing elastomer materials for critical operations

03/25/2016  An exploration of where trace metals come from, the impact they have on the industry and what can be done to reduce the risks.

The GaN RF market enjoyed a healthy increase in 2015

03/25/2016  GaN RF devices market will double over the next five years, led by GaN’s adoption across various market segments.

Amkor announces shipment of 700M RF and advanced SiP modules

03/25/2016  Amkor Technology Inc. announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.

Graphene nanoribbons: It's all about the edges

03/24/2016  As electronic components are becoming ever smaller, the industry is gradually approaching the limits of what is achievable using the traditional approach with silicon as a semiconductor material.

Bath semiconductor research boosted by new nano-scale patterning equipment

03/24/2016  The University of Bath is the only university in the UK to have installed a unique Nano-Lithography printing system, enabling Bath to lead the way in the development of advanced manufacturing techniques for nano-engineered semiconductors.

Pivotal Critical Materials Conference for semiconductor fabs to take place May 5-6, 2016

03/23/2016  The Critical Materials Conference, a pivotal, 2-day event organized by TECHCET with the support of the Critical Materials Council, will be held this year in Hillsboro, Oregon on May 5th and 6th, directly following the Council Meeting.

The United States leads growing global industrial semiconductor market

03/22/2016  The industrial semiconductor market will post an 8 percent compound annual growth rate (CAGR), as revenue rises from $43.5 billion in 2014 to $59.5 billion in 2019.

New way to control particle motions on 2-D materials

03/21/2016  Researchers at MIT and other institutions have found a new phenomenon in the behavior of a kind of quasiparticles called plasmons as they move along tiny ribbons of two-dimensional materials such as graphene and TMDs

Imec enhances its silicon photonics platform to support 50Gb/s non-return-to-zero optical lane rates

03/21/2016  Nanoelectronics research center imec presents at OFC 2016, the international event for both the science and business of optical communications held March 20-24, performance improvements of various key building blocks of its wafer-scale integrated silicon photonics platform (iSiPP).

IRT Nanoelec project integrates laser directly on silicon with a modulator

03/18/2016  IRT Nanoelec today announced the first co-integration of a III-V/silicon laser and silicon Mach Zehnder modulator demonstrating 25 Gbps transmission on a single channel.

3D NAND and 10nm investments drive equipment spending, book-to-bill data indicates

03/18/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Process Watch: Reducing production costs with process control

03/18/2016  Adding process control reduces production costs and cycle time.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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