03/30/2016  Integrated sub-fab systems allow HVM fab operators to safely and efficiently implement new processes containing hazardous process chemicals.

03/30/2016  Finding a short term solution to the neon gas shortage problem will be challenging.

03/30/2016  Optimized settings for DI water pressure at CMP and careful analysis of interconnect layout are used to improve quality on a complex analog design.

03/30/2016  A group of researchers from Osaka University and The University of Tokyo discovered a new magnet capable of controlling Dirac fermions with zero mass.

03/29/2016  Steady demand in existing end markets and growth from new end applications are pushing ASIC design activity to new levels.

03/28/2016  ACM Research (Shanghai), Inc. has announced that it has solved the problem of patterned wafer cleaning.

03/28/2016  TSMC today announced that the Company and the municipal government of Nanjing, China have signed an investment agreement.

03/25/2016  A look into how the silicide process has evolved over the years, trying to cope with the progress in scaling technology and why it could no longer be of service to finFET devices.

03/25/2016  An exploration of where trace metals come from, the impact they have on the industry and what can be done to reduce the risks.

03/25/2016  GaN RF devices market will double over the next five years, led by GaN’s adoption across various market segments.

03/25/2016  Amkor Technology Inc. announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.

03/24/2016  As electronic components are becoming ever smaller, the industry is gradually approaching the limits of what is achievable using the traditional approach with silicon as a semiconductor material.

03/24/2016  The University of Bath is the only university in the UK to have installed a unique Nano-Lithography printing system, enabling Bath to lead the way in the development of advanced manufacturing techniques for nano-engineered semiconductors.

03/23/2016  The Critical Materials Conference, a pivotal, 2-day event organized by TECHCET with the support of the Critical Materials Council, will be held this year in Hillsboro, Oregon on May 5th and 6th, directly following the Council Meeting.

03/22/2016  The industrial semiconductor market will post an 8 percent compound annual growth rate (CAGR), as revenue rises from $43.5 billion in 2014 to $59.5 billion in 2019.

03/21/2016  Researchers at MIT and other institutions have found a new phenomenon in the behavior of a kind of quasiparticles called plasmons as they move along tiny ribbons of two-dimensional materials such as graphene and TMDs

03/21/2016  Nanoelectronics research center imec presents at OFC 2016, the international event for both the science and business of optical communications held March 20-24, performance improvements of various key building blocks of its wafer-scale integrated silicon photonics platform (iSiPP).

03/18/2016  IRT Nanoelec today announced the first co-integration of a III-V/silicon laser and silicon Mach Zehnder modulator demonstrating 25 Gbps transmission on a single channel.

03/18/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

03/18/2016  Adding process control reduces production costs and cycle time.