03/17/2016  Two-dimensional electronic devices could inch closer to their ultimate promise of low power, high efficiency and mechanical flexibility with a processing technique developed at the Department of Energy's Oak Ridge National Laboratory.

03/16/2016  ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs.

03/16/2016  The semiconductor IP market is expected to reach $7.01 billion USD by 2022 from USD 3.09 Billion in 2015, at a CAGR of 10.55% between 2016 and 2022, according to the newly released report from MarketsandMarkets.

03/16/2016  With new technology getting smaller and smaller, requiring lower power, University of Cincinnati physics research points to new robust electronic technologies using quantum nanowire structures.

03/16/2016  Cadence Design Systems, Inc. today announced that its digital, signoff and custom/analog tools have achieved V1.0 Design Rule Manual (DRM) and SPICE certification from TSMC for its 10nm FinFET process.

03/16/2016  Scientists in Japan are developing methods to manufacture safer ceramic capacitors.

03/15/2016  After analyzing current trends, Semico announced the semiconductor industry is repeating the pattern from 2011-2012, albeit at a muted level.

03/15/2016  GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power amplifier (PA) technologies designed to enable performance-optimized cellular and Wi-Fi solutions in increasingly sophisticated mobile devices and hardware.

03/15/2016  SEMI today reported that worldwide sales of semiconductor manufacturing equipment totaled $36.53 billion in 2015, representing a year-over-year decrease of 3 percent.

03/14/2016  Over 50,000 attendees are expected at SEMICON China 2016 which opens tomorrow at Shanghai New International Expo Centre.

03/14/2016  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 7200 LA SmartNIL system for display manufacturing and other applications that require large-area substrates.

03/14/2016  Chemical precursors (inorganic and organic) used to form high dielectric constant (High-K) materials, metals and metal nitrides needed in advanced ICs are forecasted to reach $400M USD in global sales by 2020, as highlighted in TECHCET’s 2016 Critical Materials Report.

03/11/2016  Intel Corporation this week recognized 26 companies with its 2015 Preferred Quality Supplier (PQS) award, which celebrates exceptional performance and continuous pursuit of excellence.

03/11/2016  Nanoelectronics research center imec has today announced the opening of its new 300mm cleanroom.

03/11/2016  Semiconductor Manufacturing International Corporation and Crossbar, Inc. jointly announced today that they had signed a strategic partnership agreement on non-volatile RRAM development and production.

03/10/2016  If unaccounted for, 'non-ideal' behaviors can inflate estimates of charge-carrier mobility.

03/10/2016  Multitest successfully introduced a contacting solution for testing of extremely high frequency semiconductors in high volume production.

03/10/2016  GLOBALFOUNDRIES today announced the availability of a new set of process design kits (PDKs) with an interoperable co-design flow to help chip designers improve design efficiency and deliver differentiated RF front-end solutions in increasingly sophisticated mobile devices.

03/10/2016  EVG and JOANNEUM RESEARCH today announced that they are collaborating on a joint-solution for research and development activities in large-area nanoimprinting leveraging the EVG770 automated UV-nanoimprint lithography step-and-repeat system.

03/09/2016  A new study by University of Illinois engineers found that in the transistor laser, a device for next-generation high-speed computing, the light and electrons spur one another on to faster switching speeds than any devices available.