02/26/2016  Mentor Graphics Corp. ushered in a new era of emulation by announcing new applications for the Veloce emulation platform.

02/26/2016  The Semiconductor Industry Association (SIA) applauded congressional approval of legislation that includes a key provision to combat counterfeit semiconductors.

02/25/2016  Scientists at the University of Massachusetts Amherst identified an unexpected property in an organic semiconductor molecule that could lead to more efficient and cost-effective materials for use in displays.

02/24/2016  Today, at SPIE Advanced Lithography Conference, imec will present electrical results of DSA-formed vias, gaining insight in the impact of DSA processing variations on electrical readout.

02/24/2016  SEMI today announced the "Call for Papers" for technical sessions and presentations for SEMICON Europa 2016 which takes place 25-27 October in Grenoble, France.

02/24/2016  A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.

02/23/2016  imec, Inpria and TEL will present the first integrated patterning process for next generation high-resolution devices using a non-chemically amplified metal containing photoresist and EUV lithography.

02/23/2016  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016) will be held May 16-19 in Saratoga Springs, New York.

02/23/2016  Recent capital spending trends indicative of maturing semiconductor industry.

02/22/2016  Semiconductor Manufacturing International Corporation and Leadcore Technology Co. have announced a collaboration to launch SMIC's 28nm High-K Metal Gate, or HKMG, process.

02/19/2016  Soitec (Euronext), a manufacturer of semiconductor materials and a supplier of wafers for radio-frequency silicon-on-insulator (RF-SOI) applications, has begun mass production of 300mm RF-SOI substrates for mobile communications.

02/19/2016  Nanoelectronics research center imec and Vrije Universiteit Brussel (VUB) present a frequency division duplex (FDD) balance network, capable of dual-frequency impedance tuning for all LTE bands in the 0.7-to-1GHz range.

02/18/2016  Semiconductor lithographic use of Neon is increasing more rapidly than expected for several reasons including the delay of EUVL while demand for finer line width patterning is increasing.

02/18/2016  Flat-panel display (FPD) equipment spending this year will reach its highest level since 2011, according to IHS Inc.

02/18/2016  Fairchild Semiconductor's board of directors has determined that the unsolicited proposal received from China Resources Microelectronics Ltd and Hua Capital Management Co., Ltd. does not constitute a “Superior Proposal” as defined in the company’s agreement with ON Semiconductor.

02/18/2016  A new report from MarketsandMarkets analyzes the GaN power device market and key industry players.

02/17/2016  Mobile Experts released a new report today on Wi-Fi Semiconductors, highlighting the trends in combo chips, SoCs, power amplifiers, LNAs, switches, and Front End Modules (FEMs).

02/17/2016  Slow-growth regional GDPs weigh heavy on potential global IC growth.

02/17/2016  EV Group (EVG) today announced that WIKA Group has placed an EVG HERCULES lithography track system into production for manufacturing pressure sensor devices.

02/16/2016  Cadence Design Systems, Inc. today announced that the Cadence Innovus Implementation System has been qualified for Samsung Foundry's latest 10-nanometer (10nm) process.