10/31/2018  Innodisk is launching its industrial-grade 3D NAND SSD series, making the newest NAND flash technology available for the challenging requirements of embedded and industrial applications.

10/31/2018  Netronome today announced an open architecture for domain-specific accelerators designed to significantly reduce the burgeoning cost of silicon development as demanded by modern data center server, edge computing and automotive applications.

10/31/2018  For the first time, an Australian team has combined 2 fundamental quantum techniques on an integrated silicon platform, confirming the promise silicon -- the basis of all modern computer chips -- for quantum computing.

10/30/2018  This mmWave product is the world's first single-chip silicon-on-insulator (SOI) DSA to support the entire 9 kHz to 55 GHz frequency range.

10/30/2018  Researchers develop an artificial photosynthesis system that generates hydrogen fuel and electricity at the same time.

10/29/2018  Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

10/29/2018  Accelerates achieving test goals while meeting power, performance, and area targets.

10/29/2018  Researchers from the Georgia Institute of Technology have designed a cellular interfacing array using low-cost electronics that measures multiple cellular properties and responses in real time.

10/29/2018  SEMI Europe today confirmed its support for the joint call to future Members of the European Parliament to put industry at the core of the European Union's future.

10/26/2018  SEMI recently shared industry feedback with the European Commission on the roadmap for reviewing RoHS (the Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment).

10/26/2018  Researchers at Kanazawa University report in the journal Organic Electronics documents a new method for controlling the orientation of conducting molecules in organic solar cells that results in the enhanced light adsorption and performance of the cells.

10/25/2018  KLA-Tencor Corporation has announced plans to establish a research-and-development (R&D) center in Ann Arbor, Michigan.

10/25/2018  In 2018, a mixed bag of higher prices, shortages, and new imaging applications is driving up total O-S-D sales by 11% and expected to set a ninth consecutive record-high level of combined revenues.

10/25/2018  Insights into the rise of ASynchronous OPtical Sampling technology as one of the future measurement standard and how it can be used in the industry.

10/24/2018  Cadence Design Systems, Inc. today announced that its custom and analog/mixed-signal (AMS) IC design tools have achieved certification for Samsung Foundry’s 7nm Low Power Plus (7LPP) process technology.

10/24/2018  ClassOne Technology, a supplier of new wet process tools to the 200mm and below semiconductor manufacturing industry, today announced the sale of its flagship Solstice S8 wet process tool to the Ferdinand-Braun-Institute (FBH) in Berlin, Germany.

10/24/2018  North America-based manufacturers of semiconductor equipment posted $2.09 billion in billings worldwide in September 2018 (three-month average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

10/23/2018  Tiny device could replace expensive lab-scale equipment for many applications.

10/22/2018  Last week, the Office of the U.S. Trade Representative (USTR), on instruction from President Trump, notified Congress that the administration intends to begin bilateral trade negotiations with Japan, the European Union (EU), and the United Kingdom.

10/22/2018  MagnaChip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced that volume production of a new Display Driver IC (DDIC) for automotive panel displays has begun.