Semiconductors

SEMICONDUCTORS ARTICLES



Breakthrough enables ultra-fast transport of electrical charges in polymers

01/28/2016  A research team at Umeå University in Sweden has showed, for the first time, that a very efficient vertical charge transport in semiconducting polymers is possible by controlled chain and crystallite orientation.

A step towards keeping up with Moore's Law

01/28/2016  POSTECH researchers develop a novel and efficient fabrication technology for cross-shaped memristor.

Entegris expands R&D operations for semiconductor process liquid filtration in South Korea

01/27/2016  Entegris, Inc. announced today the expansion of its liquid filtration/purification analytical science and research and development facility in Suwon, South Korea.

Samsung, Apple continue to lead as top global semiconductor customers

01/27/2016  Samsung Electronics and Apple remained the top semiconductor buyers in 2015, representing 17.7 percent of the market, according to Gartner, Inc.

Thin wafer market worth $9.17B by 2022

01/27/2016  According to a new marketsandmarkets report, the market was valued $6.76 Billion in 2015 and estimated to reach $9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022.

North American semiconductor equipment industry posts December 2015 book-to-bill ratio of 0.99

01/27/2016  A book-to-bill of 0.99 means that $99 worth of orders were received for every $100 of product billed for the month.

Entegris announces new post-CMP cleaning solutions

01/26/2016  Entegris, Inc., a developer of yield-enhancing materials and solutions, today announced new post-chemical mechanical planarization (post-CMP) cleaning solutions for semiconductor manufacturing.

China semiconductor acquisitions surge; SEMICON China brings the new market into focus

01/26/2016  During SEMICON China 2016 on March 15-17 in Shanghai, key government decision makers, IC fund managers, and global industry analysts will share their insights on China's IC manufacturing policy.

SEMICON Korea opening: Memory and mobility drive IC manufacturing

01/26/2016  SEMICON Korea 2016 at COEX in Seoul opens tomorrow with more than 540 exhibiting companies and an expected 40,000 attendees.

Cornell-led team creates gallium nitride power diode

01/22/2016  Making tiny switches do enormous jobs in a more efficient way than current technology allows is one of the goals of a research team led by Cornell engineering professor Huili (Grace) Xing.

Fujifilm to build a new plant for advanced semiconductor materials in Taiwan

01/22/2016  Fujifilm Corporation recently announced that its semiconductor business subsidiary, FUJIFILM Electronic Materials Co.,Ltd. will build a new plant for manufacturing advanced semiconductor materials in the city of Tainan, to expand its production in Taiwan.

ON Semiconductor extends tender offer to acquire Fairchild Semiconductor

01/22/2016  ON Semiconductor Corporation announced that it has extended its previously announced tender offer to purchase all of the outstanding shares of common stock of Fairchild Semiconductor International Inc. for $ 20.00 per share in cash the Offer pending the satisfaction of the conditions to the Offer set forth in the merger agreement entered into on November 18, 2015 between ON Semiconductor and Fairchild.

2016 Critical Materials Council (CMC) Seminar – Call for Papers

01/21/2016  The Critical Materials Council (CMC) and TECHCET have issued a call for papers to be presented at the “Critical Materials for Device Driven Scaling” Seminar to be held May 5-6, 2016 in Hillsboro, Oregon, USA.

Microsemi launches PIN diode switch element

01/21/2016  Microsemi Corporation today announced a new high power monolithic microwave surface mount (MMSM) series-shunt SP2T PIN diode reflective switch.

Molecular-like photochemistry from semiconductor nanocrystals

01/21/2016  Researchers from North Carolina State University have demonstrated the transfer of triplet exciton energy from semiconductor nanocrystals to surface-bound molecular acceptors, extending the lifetime of the originally prepared excited state by six orders of magnitude.

Semiconductor R&D growth slows in 2015

01/21/2016  Industry-wide R&D expenditures grew 0.5% to a record-high $56.4 billion in 2015. Top 10 R&D spenders collectively increased expenditures by nearly 2% in the year.

Semiconductor veteran Tom Werthan to lead finance operations as Chief Financial Officer of Phononic

01/20/2016  Tom Werthan, a veteran semiconductor and finance executive experienced in leading financial operations at public and privately-held technology companies, has been appointed Chief Financial Officer at Phononic.

Worldwide device shipments to grow 1.9% in 2016, while end-user spending to decline for the first time

01/20/2016  Worldwide combined shipments of devices (PCs, tablets, ultramobiles and mobile phones) are expected to reach 2.4 billion units in 2016 , a 1.9 percent increase from 2015, according to Gartner, Inc.

Gartner analysts reveal unexpected implications arising from the Internet of Things

01/19/2016  More than half of major new business processes and systems will incorporate some element of the Internet of Things (IoT) by 2020, according to Gartner, Inc.

Microchip Technology to acquire Atmel

01/19/2016  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, and Atmel Corporation) today announced that Microchip has signed a definitive agreement to acquire Atmel for $8.15 per share in a combination of cash and Microchip common stock.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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