10/05/2015  The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $27.7 billion for the month of August 2015.

10/05/2015  Showa Denko has developed a new grade of silicon carbide (SiC) epitaxial wafers for power devices with very low defect density.

10/05/2015  The path to alternative scaling is now open.

10/02/2015  Yamaichi Electronics presents Test Contactors for lab and reliability applications and ultra fine pitch semiconductor devices.

10/01/2015  IBM Research announced an engineering breakthrough that could accelerate carbon nanotubes replacing silicon transistors to power future computing technologies.

10/01/2015  Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

10/01/2015  Yang and his collaborators have created a synthetic “leaf” that is a hybrid system of semiconducting nanowires and bacteria.

10/01/2015  ?Invention of the first integrated circularly polarized light detector on a silicon chip opens the door for development of small, portable sensors that could expand the use of polarized light for many applications.

10/01/2015  Flip Chip technology is expected to reach $25 billion market value and wafer demand of 32 million (12” eq. wafers) in 2020, supported by the wider adoption of Cu pillar technology.

09/30/2015  Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto multi-layer stacks of wafers in order to consume less power and perform significantly faster while reducing overall footprint.

09/30/2015  ASML announced the first shipment of its new TWINSCAN (TM) NXT:1980Di immersion lithography system to support increasingly demanding multiple-patterning performance requirements.

09/30/2015  At the 61st annual IEEE International Electron Devices Meeting (IEDM) subjects under discussion will encompass a range of topics critical to the continuing progress of the industry.

09/29/2015  The eBeam Initiative announced the completion of its fourth annual eBeam Initiative members' perceptions survey.

09/29/2015  D2S announced that it has partnered with Advantest to integrate D2S' Wafer Plane Analysis engine into Advantest's Mask MVM-SEM (Multi Vision Metrology Scanning Electron Microscope) systems.

09/29/2015  Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

09/29/2015  Berkeley Lab Researchers produce the first ultrathin sheets of perovskite hybrids.

09/29/2015  Hillcrest Labs unveiled its MotionEngine (TM) Wear software with always-on, sensor-enabled features optimized for the latest generation of wearable devices.

09/28/2015  The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

09/28/2015  Semiconductor Research Corporation (SRC) today announced that ARM has joined SRC’s Global Research Collaboration (GRC) program.

09/28/2015  ULVAC, Inc. announced that the company has developed G-TRAN series multi ionization gauge ST2, a transducer-type ionization vacuum gauge.